Module Housing: IP Rating IP65 minimum, Weight 300-500g

Component Specifications

Definition

A precision-engineered structural component designed to house, protect, and thermally manage sensitive receiver/detector modules in measurement, communication, or sensing equipment. It provides electromagnetic shielding, mechanical protection, and environmental sealing while maintaining precise alignment of internal components.

Working Principle

The housing functions as a protective barrier that isolates sensitive electronic components from external environmental factors (moisture, dust, EMI/RFI interference, mechanical shock) while facilitating heat dissipation through designed thermal pathways. It maintains dimensional stability to ensure proper alignment of optical/electronic elements and provides mounting interfaces for integration into larger systems.

Materials

Aluminum alloy 6061-T6 (primary), with optional EMI shielding gaskets (silicon rubber with embedded conductive particles) and thermal interface materials (silicone-based thermal pads)

Technical Parameters

Parameter	Typical range	Notes & selection driver
Weight	300-500g
Mounting	M4 threaded inserts (4x)
IP Rating	IP65 minimum
Dimensions	Varies by application (typical: 150x100x50mm)
EMI Shielding	≥40dB attenuation (30MHz-1GHz)
Surface Finish	Anodized (Type II, 15-25μm)
Flatness Tolerance	0.1mm/m
Thermal Conductivity	167 W/m·K (aluminum)
Operating Temperature	-20°C to +85°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 9001, IEC 60529, MIL-STD-810G, RoHS

Parent Products

This component is used in the following industrial products

Receiver/Detector Module

A critical electronic component within an alignment sensor system that receives and detects signals for position measurement.

View Product Details

Port Interface Modules

Modular components that provide physical connectivity and interface conversion capabilities for industrial network switches.

View Product Details

Engineering Analysis

Risks & Mitigation

EMI leakage through gaps
Thermal runaway due to poor heat dissipation
Mechanical deformation under load
Corrosion in harsh environments
Signal interference from improper grounding

FMEA Triads

Trigger: Inadequate EMI gasket compression
Failure: Electromagnetic interference affecting signal integrity
Mitigation: Implement compression stops and specify conductive gaskets with proper compression force requirements

Trigger: Poor thermal interface between housing and heat-generating components
Failure: Overheating leading to component degradation or failure
Mitigation: Design with integrated heat sinks and specify thermal interface materials with appropriate conductivity and thickness

Trigger: Incorrect material selection for operating environment
Failure: Corrosion or material degradation
Mitigation: Specify appropriate alloys and surface treatments based on environmental exposure analysis

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1mm on critical dimensions, ±0.05mm on mounting features

Test Method

EMI testing per MIL-STD-461, thermal cycling per IEC 60068-2-14, IP testing per IEC 60529, dimensional verification via CMM

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Module Housing

2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

DEGSON

Zhejiang, CN

Also makes: Feed-through Terminal Blocks, Power Distribution Module, Power Distribution and 9 more

Listed on the company's own website · profile compiled by CNFX from public sources

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Nanjing Tangent Fluid Technology Co. Ltd

Jiangsu, CN

Also makes: Filtration System

Listed on the company's own website · profile compiled by CNFX from public sources

View profile Send enquiry

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

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Frequently Asked Questions

What are the key considerations when selecting a module housing?

Key factors include EMI/RFI shielding requirements, thermal management needs, environmental protection (IP rating), dimensional stability, material compatibility, and mounting/interfacing requirements with other system components.

Can module housings be customized for specific applications?

Yes, they are often custom-designed to match specific receiver/detector module dimensions, thermal profiles, and interface requirements. Modifications can include custom cutouts, mounting features, shielding configurations, and surface treatments.

How does the housing affect module performance?

Proper housing design prevents signal interference through EMI shielding, maintains component alignment through dimensional stability, prevents overheating through thermal management, and protects against environmental damage - all critical for reliable module operation.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Module Housing