Editorial Technical Reference

Receiver/Detector Module

This page explains how Receiver/Detector Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A critical electronic component within an alignment sensor system that receives and detects signals for position measurement.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Receiver/Detector Module

Definition
The Receiver/Detector Module is an essential sub-assembly of an Alignment Sensor system, responsible for capturing optical, electromagnetic, or other signals emitted by a transmitter or target. It converts these signals into electrical data that the sensor's processing unit uses to determine precise position, alignment, or displacement measurements. Its performance directly impacts the sensor's accuracy, resolution, and reliability.

The module typically consists of a photodiode array, CCD/CMOS sensor, or other transducer elements. It receives incoming signals (e.g., laser beams, infrared light). These signals are converted into analog electrical currents, which are then amplified, filtered, and digitized by onboard circuitry. The resulting digital data is processed to identify the signal's centroid, intensity, or pattern, enabling precise calculation of the target's position relative to the sensor.

Key parameters include operating wavelength (650–980 nm), sensitivity (0.1–1.0 A/W), response time (1–10 ns), active area (0.5–10 mm²), supply voltage (3.3–5.0 V DC), output signal (0–5 V), operating temperature (-20–70 °C), storage temperature (-40–85 °C), ingress protection (IP40–IP67 per IEC 60529), material (aluminum/ABS housing, PCB FR4), weight (10–50 g), and dimensions (20×20×10 to 50×50×20 mm). These values are reference ranges; actual specifications must be confirmed with the manufacturer for the specific model and application.

This directory entry is for informational purposes only. Verify all model-specific values and standards with the legal manufacturer or supplier before procurement or integration.
Working Principle
The module uses photodiode arrays, CCD/CMOS sensors, or other transducers to capture incoming optical or electromagnetic signals. These signals are converted to analog currents, then amplified, filtered, and digitized by onboard circuitry. The digital data is processed to determine the signal's centroid, intensity, or pattern, enabling precise position calculation relative to the sensor.
Common Materials
Silicon (for photodiodes/sensors), Printed Circuit Board (PCB), Aluminum alloy (housing)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Operating Wavelength650–980 nmMust match emitter wavelength
Sensitivity0.1–1.0 A/WHigher for low-light applications
Response Time1–10 nsFaster for high-speed measurement
Active Area0.5–10 mm²Larger area improves alignment tolerance
Supply Voltage3.3–5.0 V DCTypical digital logic levels
Output Signal0–5 VAnalog or digital depending on model
Operating Temperature-20–70 °CExtended range available on request
Storage Temperature-40–85 °CNon-condensing environment
Ingress ProtectionIP40–IP67IP67 for dusty/wet environmentsIEC 60529
MaterialAluminum/ABSHousing material; PCB is FR4
Weight10–50 gDepends on housing and connector
Dimensions20×20×10 – 50×50×20 mmCustom sizes available

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Photodetector Array
    Converts incoming optical signals into electrical charge
    Material: Silicon
  • Signal Conditioning Circuit
    Amplifies and filters the raw electrical signal from the detector
    Material: PCB with electronic components
  • Protective Window Part
    Seals and protects the sensitive detector elements from dust and damage
    Material: Optical glass or sapphire
  • Module Housing Part
    Provides mechanical structure, shielding, and thermal management
    Material: Anodized aluminum
  • Digitizing Circuit
    Turns the conditioned detector signal into digital samples on the module itself.
  • Processing Unit
    Computes the spot centroid from the digital data — the step that turns light into a position.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Receiver/Detector Module.

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 bar (non-pressurized environment)
other spec: Signal frequency range: 400-800 MHz, Power supply: 12-24 VDC, IP rating: IP67
temperature: -40°C to +85°C
Media Compatibility
✓ Clean dry air ✓ Inert gases (e.g., nitrogen, argon) ✓ Non-conductive liquids (e.g., deionized water, dielectric oils)
Unsuitable: Conductive or corrosive media (e.g., saltwater, acids, metal slurries)
Sizing Data Required
  • Required measurement resolution (e.g., 0.1 mm)
  • Maximum measurement distance (e.g., 0-10 m)
  • Signal-to-noise ratio requirement (e.g., >20 dB)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal drift/attenuation
Cause: Degradation of internal optical components (e.g., lenses, mirrors) due to contamination, thermal cycling, or mechanical misalignment, leading to reduced sensitivity or inaccurate readings.
Electronic component failure
Cause: Thermal stress, voltage spikes, or moisture ingress damaging critical circuits (e.g., amplifiers, processors), resulting in complete loss of function or erratic output.
Maintenance Indicators
  • Intermittent or unstable output readings during calibration checks
  • Unusual audible humming, clicking, or complete silence from the module during operation (if it normally emits diagnostic sounds)
Engineering Tips
  • Implement regular preventive cleaning of optical surfaces using manufacturer-approved methods and materials to prevent contamination buildup.
  • Ensure stable environmental conditions (temperature, humidity) and use surge protection on power supplies to minimize thermal and electrical stress on electronic components.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 61000-6-2 Electromagnetic Compatibility (EMC) CE Marking (EU Directive 2014/35/EU Low Voltage Directive)

Quoted from the published standard.

Manufacturing Precision
  • Optical Alignment: +/-0.01°
  • Housing Dimensions: +/-0.05mm
Quality Inspection
  • Signal-to-Noise Ratio (SNR) Testing
  • Environmental Stress Screening (ESS) including thermal cycling and vibration testing

Manufacturers of Receiver/Detector Module

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

UVLEDTEK
Shanghai, CN
Listed on the company's own website · profile compiled by CNFX from public sources

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

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Frequently Asked Questions

What is the operating wavelength range?

The reference range is 650–980 nm, but it must match the emitter wavelength. Confirm the exact range with the manufacturer for your application.

What output signal types are available?

Output can be analog or digital depending on the model, with a voltage range of 0–5 V. Check the datasheet for the specific output format.

What is the ingress protection rating?

The reference range is IP40–IP67 per IEC 60529. Choose the appropriate rating based on the operating environment, and verify with the supplier.

Can the module operate in low-light conditions?

Sensitivity ranges from 0.1 to 1.0 A/W, with higher values suitable for low-light applications. Confirm the sensitivity for your specific lighting conditions.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
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