Protective housing for crystal oscillator components that provides mechanical stability, environmental protection, and electrical shielding.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Dimensions | Standard sizes: 3.2x2.5mm, 5.0x3.2mm, 7.0x5.0mm | |
| Lead Count | 4-pin, 6-pin, 8-pin configurations | |
| Package Type | SMD (Surface Mount Device), DIP (Dual In-line Package), TO (Transistor Outline) | |
| Sealing Type | Hermetic, Semi-hermetic, Non-hermetic | |
| Mounting Height | 0.8mm to 1.2mm typical | |
| Storage Temperature | -55°C to +125°C | |
| Operating Temperature | -40°C to +85°C (Commercial), -40°C to +125°C (Industrial) | |
| Moisture Sensitivity Level | MSL 1 to MSL 3 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A precise timing device that generates stable clock signals for electronic circuits
An electronic filter that passes frequencies within a specific range while attenuating frequencies outside that range.
Electronic component that combines or multiplies signals in a demodulator circuit
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Package/Housing.
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Hermetic packages provide complete sealing against moisture and gases using metal, ceramic, or glass materials, offering superior long-term stability and reliability. Non-hermetic packages use plastic materials with lower cost but reduced protection against environmental factors.
Package materials significantly impact thermal characteristics, mechanical stability, and EMI shielding. Ceramic packages offer excellent thermal conductivity and stability, metal packages provide superior EMI shielding, while plastic packages offer cost advantages with adequate performance for many commercial applications.
Key considerations include: operating environment (temperature, humidity), required frequency stability, EMI requirements, mounting method (SMD vs through-hole), space constraints, thermal management needs, and cost targets for the specific application.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.