INDUSTRY COMPONENT

Package/Housing

Protective housing for crystal oscillator components that provides mechanical stability, environmental protection, and electrical shielding.

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Component Specifications

Definition
The package/housing in a crystal oscillator is a precisely engineered enclosure that contains and protects the quartz crystal resonator and associated electronic components. It serves multiple critical functions including mechanical support, thermal management, electromagnetic interference (EMI) shielding, and environmental protection against moisture, dust, and contaminants. The housing maintains the crystal's precise frequency stability by providing controlled atmospheric conditions and minimizing external vibrations and thermal fluctuations.
Working Principle
The package/housing operates on principles of mechanical protection, thermal management, and electromagnetic compatibility. It provides a hermetic or semi-hermetic seal to maintain stable internal conditions for the quartz crystal resonator, prevents contamination from external elements, dissipates heat generated during operation, and shields the sensitive oscillator circuitry from external electromagnetic interference while containing its own emissions.
Materials
Common materials include: Kovar alloy (Fe-Ni-Co) for metal packages, ceramic (alumina Al₂O₃) for surface-mount devices, plastic (PPS, LCP) for cost-effective applications, and glass for specialized hermetic seals. Lead frames typically use Alloy 42 or copper alloys. Sealing materials include glass frit, solder, or epoxy resins.
Technical Parameters
  • Dimensions Standard sizes: 3.2x2.5mm, 5.0x3.2mm, 7.0x5.0mm
  • Lead Count 4-pin, 6-pin, 8-pin configurations
  • Package Type SMD (Surface Mount Device), DIP (Dual In-line Package), TO (Transistor Outline)
  • Sealing Type Hermetic, Semi-hermetic, Non-hermetic
  • Mounting Height 0.8mm to 1.2mm typical
  • Storage Temperature -55°C to +125°C
  • Operating Temperature -40°C to +85°C (Commercial), -40°C to +125°C (Industrial)
  • Moisture Sensitivity Level MSL 1 to MSL 3
Standards
ISO 9001, IEC 60122-1, JESD22-A113, MIL-PRF-55310

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Package/Housing.

oscillator housing crystal package SMD enclosure hermetic sealing EMI shielding electronic packaging quartz crystal housing Package/Housing Package/Housing in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Crystal Oscillator

A precise timing device that generates stable clock signals for electronic circuits

View Product Details

Bandpass Filter

An electronic filter that passes frequencies within a specific range while attenuating frequencies outside that range

View Product Details

Engineering Analysis

Risks & Mitigation
  • Hermetic seal failure leading to moisture ingress
  • Thermal stress causing package cracking
  • EMI radiation exceeding regulatory limits
  • Mechanical vibration affecting frequency stability
  • Solder joint failure due to thermal cycling
FMEA Triads
Trigger: Inadequate sealing process control
Failure: Moisture ingress leading to frequency drift and eventual oscillator failure
Mitigation: Implement hermeticity testing (fine/ gross leak tests), use proper sealing materials, maintain controlled manufacturing environment
Trigger: Coefficient of thermal expansion (CTE) mismatch between materials
Failure: Package cracking or delamination during temperature cycling
Mitigation: Select materials with compatible CTE, implement stress relief designs, use compliant adhesives and sealants
Trigger: Insufficient EMI shielding design
Failure: Electromagnetic interference affecting nearby circuits or failing regulatory compliance
Mitigation: Implement proper grounding, use conductive coatings or metal shielding, optimize package geometry for EMI containment

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±10ppm to ±50ppm frequency stability, ±3% to ±10% frequency accuracy
Test Method
Environmental stress screening (ESS), thermal cycling (-55°C to +125°C), vibration testing (10-2000Hz), hermeticity testing (helium leak detection), EMI/EMC testing per FCC/CE standards

Buyer Feedback

★★★★☆ 4.7 / 5.0 (24 reviews)

"The technical documentation for this Package/Housing is very thorough, especially regarding technical reliability."

"Reliable performance in harsh Computer, Electronic and Optical Product Manufacturing environments. No issues with the Package/Housing so far."

"Testing the Package/Housing now; the technical reliability results are within 1% of the laboratory datasheet."

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Frequently Asked Questions

What is the difference between hermetic and non-hermetic crystal oscillator packages?

Hermetic packages provide complete sealing against moisture and gases using metal, ceramic, or glass materials, offering superior long-term stability and reliability. Non-hermetic packages use plastic materials with lower cost but reduced protection against environmental factors.

How does the package material affect crystal oscillator performance?

Package materials significantly impact thermal characteristics, mechanical stability, and EMI shielding. Ceramic packages offer excellent thermal conductivity and stability, metal packages provide superior EMI shielding, while plastic packages offer cost advantages with adequate performance for many commercial applications.

What are the key considerations when selecting a crystal oscillator package?

Key considerations include: operating environment (temperature, humidity), required frequency stability, EMI requirements, mounting method (SMD vs through-hole), space constraints, thermal management needs, and cost targets for the specific application.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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