Package Pins: Voltage Rating 50V-250V, Pitch 0.5mm-2.54mm

Component Specifications

Definition

Package pins are metallic leads or terminals extending from the housing of an integrated circuit or semiconductor device, designed to establish reliable electrical connections through soldering or insertion into sockets. In line driver/receiver applications, these pins transmit differential signals, power, ground, and control signals while ensuring signal integrity and mechanical stability.

Working Principle

Package pins function as electrical conduits by conducting signals and power between the semiconductor die inside the package and the printed circuit board. They maintain impedance matching, minimize signal loss through proper material conductivity, and provide mechanical attachment through solder joints or contact pressure.

Materials

Copper alloy (typically C19400 or C70250) with nickel/gold plating (ENIG or electrolytic gold over nickel) for corrosion resistance and solderability. Lead-free finishes comply with RoHS standards.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Pitch	0.5mm-2.54mm
Pin Count	8-64 pins
Solderability	Meets IPC-J-STD-002
Current Rating	1A-3A per pin
Voltage Rating	50V-250V
Plating Thickness	Gold: 0.05-0.25μm, Nickel: 2-5μm
Contact Resistance	<20mΩ
Insulation Resistance	>1000MΩ
Operating Temperature	-40°C to +125°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IPC-7351, JEDEC MO-153, IEC 60748

Parent Products

This component is used in the following industrial products

Line Driver/Receiver

Electronic component that transmits and receives signals over communication lines

View Product Details

RF/IR Transmitter IC

An integrated circuit designed to generate and modulate RF or infrared signals for wireless transmission.

View Product Details

Engineering Analysis

Risks & Mitigation

Solder joint fatigue under thermal cycling
Corrosion in humid environments
Mechanical damage during assembly
Signal degradation at high frequencies

FMEA Triads

Trigger: Thermal expansion mismatch between pin material and PCB
Failure: Solder joint cracking leading to intermittent or open connections
Mitigation: Use compliant pin designs, optimize solder alloy, implement strain relief in PCB layout

Trigger: Insufficient plating thickness or contamination
Failure: Poor solderability and increased contact resistance
Mitigation: Implement strict plating quality control, use ENIG or immersion gold finishes, follow IPC plating standards

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Pin position tolerance ±0.1mm, plating thickness tolerance ±10%

Test Method

Visual inspection per IPC-A-610, solderability testing per J-STD-002, electrical continuity testing, thermal cycling per JESD22-A104

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Package Pins

Manufacturer profiles associated with Package Pins.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What are the common failure modes of package pins?

Common failures include solder joint cracks due to thermal cycling, corrosion from environmental exposure, mechanical bending or breakage during handling, and plating degradation leading to poor connectivity.

How do package pins affect signal integrity in high-speed applications?

Package pins introduce parasitic inductance and capacitance that can cause signal reflection, attenuation, and crosstalk. Proper pin design with controlled impedance and short lengths is critical for maintaining signal integrity in high-speed line driver/receiver circuits.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Package Pins