Package substrate is a critical component in electronic packaging that provides mechanical support, electrical connections, and thermal management for integrated circuits.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thickness | 0.2-1.6 mm | |
| Layer Count | 4-12 layers typical | |
| Copper Weight | 0.5-2 oz/ft² | |
| Dielectric Constant | 3.5-4.5 (at 1 MHz) | |
| Minimum Trace/Space | 25/25 μm | |
| Thermal Conductivity | 0.2-0.5 W/m·K | |
| Operating Temperature | -40°C to 125°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
An electronic component that amplifies and distributes clock signals within a system.
The active component within a voltage regulator IC that controls the output voltage by adjusting its resistance.
A group of multiple transistors integrated into a single semiconductor package for use in low-noise amplification circuits.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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A package substrate is specifically designed for mounting and interconnecting integrated circuits, with finer features, higher density, and materials optimized for thermal and electrical performance with ICs. A PCB is for mounting multiple components and has larger features for broader system integration.
Material properties like dielectric constant and loss tangent directly affect signal propagation speed and integrity. Low-loss materials are crucial for clock signals to minimize jitter and skew, ensuring precise timing across outputs.
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