Editorial Technical Reference

Line Driver/Receiver

This page explains how Line Driver/Receiver is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

Electronic component that transmits and receives signals over communication lines

View Full Specifications Explore Manufacturing Sources

Product Specifications

Technical details and manufacturing context for Line Driver/Receiver

Definition
A line driver/receiver is an integrated circuit or discrete component within the Physical Layer (PHY) of communication systems. It amplifies and conditions digital signals for transmission over cables or transmission lines, and receives and conditions incoming signals from the line. This component serves as the interface between digital processing circuitry and the physical transmission medium, ensuring signal integrity over distance and in electrically noisy environments. The line driver converts low-voltage digital signals from internal circuitry into higher-voltage, higher-current signals suitable for transmission over longer distances with minimal signal degradation. The receiver amplifies and conditions incoming signals from the transmission line, converting them back to clean digital signals for the receiving circuitry. Both functions typically include protection against electromagnetic interference, signal conditioning, and impedance matching. In a product directory context, this entry covers components with the following reference parameters: supply voltage 3.3–5.5 V (below 3.3 V may cause undefined output levels), data rate 1–50 Mbps (higher rates require lower capacitance loads), number of channels 1–4 (more channels increase package size), output voltage swing ±5–±15 V (affects signal integrity over long lines), input threshold 0.8–2.0 V (TTL-compatible), propagation delay 10–50 ns (critical for timing-sensitive applications), operating temperature -40–85 °C (outside range may cause performance degradation), ESD protection ±2–±15 kV per IEC 61000-4-2 (higher protection for industrial environments), package type SOIC-8 to SOIC-16 (affects PCB footprint and thermal performance), and supply current 1–10 mA (lower current for battery-powered devices). Materials commonly used include silicon, copper, and plastic. These values are reference ranges and must be verified for the specific model and application with the legal manufacturer or supplier. The listed ESD standard is a procurement reference, not a guarantee of certification.
Working Principle
The line driver converts low-voltage digital signals from internal circuitry into higher-voltage, higher-current signals suitable for transmission over longer distances with minimal signal degradation. The receiver amplifies and conditions incoming signals from the transmission line, converting them back to clean digital signals for the receiving circuitry. Both components typically include protection against electromagnetic interference, signal conditioning, and impedance matching.
Common Materials
Silicon, Copper, Plastic
Technical Parameters
ParameterTypical rangeNotes & selection driver
Supply Voltage3.3–5.5 VBelow 3.3 V may cause undefined output levels
Data Rate1–50 MbpsHigher rates require lower capacitance loads
Number of Channels1–4More channels increase package size
Output Voltage Swing±5–±15 VAffects signal integrity over long lines
Input Threshold0.8–2.0 VTTL-compatible thresholds
Propagation Delay10–50 nsCritical for timing-sensitive applications
Operating Temperature-40–85 °COutside range may cause performance degradation
ESD Protection±2–±15 kVHigher protection for industrial environmentsIEC 61000-4-2
Package TypeSOIC-8–SOIC-16Affects PCB footprint and thermal performance
Supply Current1–10 mALower current for battery-powered devices

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Driver Circuit
    Amplifies and conditions outgoing digital signals for transmission
    Material: Silicon
  • Receiver Circuit
    Amplifies and conditions incoming signals from transmission line
    Material: Silicon
  • Protection Diodes Part
    Protects against voltage spikes and electrostatic discharge
    Material: Silicon
  • Package Pins Part
    Electrical connections to the circuit board
    Material: Copper alloy
  • Impedance Matching Circuit
    Matches the line so the launched signal is not reflected back down the cable.

Application & selection

Application Fit & Sizing Matrix

Operational Limits
voltage: 3.3V to 5V typical, up to 15V for some models
data rate: Up to 100 Mbps (standard), 1 Gbps+ (high-speed variants)
temperature: -40°C to +85°C (industrial grade), -55°C to +125°C (military grade)
esd protection: ±15kV HBM typical
common mode range: ±7V to ±15V typical
Media Compatibility
✓ RS-485/422 communication networks ✓ Industrial Ethernet backbones ✓ PLC-to-sensor digital signaling
Unsuitable: High-voltage power transmission lines (>1kV AC/DC)
Sizing Data Required
  • Required data rate (bps)
  • Communication protocol/standard (e.g., RS-485, CAN, Profibus)
  • Cable length/distance between nodes

Risk, maintenance & compliance

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal degradation
Cause: Electrical noise interference from nearby high-power equipment, poor grounding, or electromagnetic interference (EMI) compromising signal integrity.
Overheating and thermal shutdown
Cause: Excessive current draw, inadequate ventilation, or ambient temperature exceeding operational limits, leading to component failure.
Maintenance Indicators
  • Intermittent or erratic data transmission, such as signal dropouts or corrupted data packets.
  • Audible buzzing or humming from the device, or visible signs of overheating like discoloration or a burning smell.
Engineering Tips
  • Implement proper shielding and grounding practices to minimize electrical noise and EMI, ensuring signal integrity and reliability.
  • Regularly monitor and maintain environmental conditions, including temperature control and ventilation, to prevent thermal stress and extend component lifespan.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 11898-2:2016 (CAN physical layer) ANSI/TIA/EIA-422-B (Electrical characteristics) DIN EN 61000-6-2 (EMC immunity)

Quoted from the published standard.

Manufacturing Precision
  • Output voltage swing: +/-5% of nominal
  • Propagation delay: +/-10% of specified maximum
Quality Inspection
  • High-potential (hipot) dielectric withstand test
  • Eye diagram analysis for signal integrity
Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

Compare the published product scope and source details, then include your specifications and quantity in an enquiry.

Manufacturers of Line Driver/Receiver

Manufacturer profiles associated with Line Driver/Receiver.

Sourcing Line Driver/Receiver from China?
Tell us your specification and target quantity — we will match it against manufacturer records and come back with the factories that fit.
Request manufacturers We manufacture this

Explore company information and manufacturing capabilities, then discuss the scope of your project with a relevant supplier.

Buyer enquiry

Request manufacturing insight for Line Driver/Receiver

Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.

Where it goes
Straight to the CNFX editorial desk, and to the manufacturer if this product is linked to a claimed profile. Nothing is broadcast to a supplier list.
Your details stay here
We do not sell or rent enquiry data, and we do not add you to a mailing list. Used only to answer this request.
No commission, no middleman
CNFX is a directory. We take no cut of any order and never negotiate on a supplier's behalf.
What to include
Share your product specifications, quantity, destination and target delivery date.

Your business information is used only to process this request.

Thank you! Your message has been sent. We'll respond within 1–3 business days.
Sorry, we couldn't send your message. Please try again, or email us at [email protected].

Frequently Asked Questions

What is the typical supply voltage range for a line driver/receiver?

The reference supply voltage range is 3.3–5.5 V. Operating below 3.3 V may cause undefined output levels. Always verify the exact range for the specific model with the manufacturer.

How does the data rate affect the selection of a line driver/receiver?

The reference data rate range is 1–50 Mbps. Higher rates require lower capacitance loads on the line. Confirm the maximum data rate and load conditions for your application.

What ESD protection levels are available?

The reference ESD protection is ±2–±15 kV per IEC 61000-4-2. Higher protection levels are suitable for industrial environments. Verify the actual rating with the supplier.

What package types are available?

Reference package types include SOIC-8 to SOIC-16. The package affects PCB footprint and thermal performance. Check the datasheet for exact dimensions and thermal characteristics.

Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Related equipment

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Communication PHY
View system integration details
PHY (Physical Layer) Chip
View system integration details
Protocol Transceiver IC
View system integration details
Physical Layer Interface (PHY)
View system integration details
Encoder/Decoder
View system integration details

Industrial Ecosystem & Supply Chain Structure

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 12 October 2026

Need to Manufacture Line Driver/Receiver?

Compare manufacturer profiles with relevant product and process capability.

Create Manufacturer Profile Contact Us
Previous Product
XY Positioning Stage
Last Product
Get QuotesChat