PCB is a foundational electronic component that mechanically supports and electrically connects electronic components using conductive tracks, pads, and other features etched from copper sheets laminated onto a non-conductive substrate.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thickness | 0.8mm-1.6mm | |
| Layer Count | 4-12 layers | |
| Copper Weight | 1oz-2oz | |
| Surface Finish | ENIG | |
| Minimum Spacing | 0.1mm | |
| Dielectric Constant | 4.2-4.5 (FR-4) | |
| Impedance Tolerance | ±10% | |
| Minimum Trace Width | 0.1mm | |
| Operating Temperature | -40°C to +125°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A hardware component that stores data and instructions for processing by a control unit or signal processor.
A printed circuit board that provides input/output connectivity between a control computer and external devices.
A hardware component that provides temporary and/or permanent data storage for the Main Control Unit (MCU).
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
Manufacturer profiles associated with PCB (Printed Circuit Board).
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
PCB refers to the bare board without components, while PCBA (Printed Circuit Board Assembly) is the completed board with all electronic components soldered onto it.
Multilayer PCBs allow for more complex routing of power, ground, and signal traces in limited space, provide better signal integrity through dedicated ground planes, and enable higher component density required for modern memory modules.
Delamination occurs when layers separate due to excessive heat during soldering, moisture absorption before assembly, or mechanical stress. Proper storage conditions and controlled manufacturing processes prevent this issue.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.