Planarization Layer: Thickness 100-300 nm

Q: Why is planarization critical for micro-lens arrays?

Planarization eliminates surface irregularities that cause light scattering, ensuring uniform focal lengths and optical efficiency across thousands of micro-lenses.

Q: What materials work best for planarization layers?

Low-stress silicon dioxide and specialized optical polymers provide optimal smoothness, thermal stability, and refractive index matching for most applications.

Component Specifications

Definition

In micro-lens array fabrication, the planarization layer is a critical intermediate component deposited between lens elements or substrate layers to eliminate surface topography, reduce scattering losses, and ensure uniform optical performance across the array. This layer typically consists of polymer or dielectric materials with precise thickness control (50-500 nm) and optical properties matching the lens system requirements.

Working Principle

The planarization layer operates by filling surface irregularities through spin-coating or chemical vapor deposition, then curing to form a smooth optical interface. Its refractive index and thickness are engineered to minimize Fresnel reflections while maintaining mechanical stability during subsequent lithography and etching processes.

Materials

Polyimide, SU-8 photoresist, SiO₂, Si₃N₄, or specialized optical polymers with refractive indices between 1.45-1.65, thermal stability >200°C, and UV/visible light transparency >90%.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Thickness	100-300 nm
Refractive Index	1.46-1.62
Adhesion Strength	>20 MPa
Surface Roughness	<2 nm RMS
Thermal Expansion	<20 ppm/°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

ISO 10110-7, ISO 14999-4, DIN 58141-2

Parent Products

This component is used in the following industrial products

Micro-lens Array

An array of microscopic lenses integrated onto the surface of an image sensor pixel array to focus incident light onto the photosensitive area of each pixel.

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Engineering Analysis

Risks & Mitigation

Delamination under thermal cycling
Optical inhomogeneity from uneven curing
Contamination during deposition

FMEA Triads

Trigger: Inadequate surface preparation
Failure: Poor adhesion and layer delamination
Mitigation: Implement plasma cleaning and adhesion promoters

Trigger: Non-uniform curing
Failure: Variable refractive index across surface
Mitigation: Use controlled thermal ramping and in-situ monitoring

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Thickness ±5%, refractive index ±0.005, surface roughness <2 nm

Test Method

Ellipsometry for thickness/refractive index, AFM for surface roughness, spectrophotometry for optical transmission

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Planarization Layer

Manufacturer profiles associated with Planarization Layer.

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Frequently Asked Questions

Why is planarization critical for micro-lens arrays?