Editorial Technical Reference

Micro-lens Array

This page explains how Micro-lens Array is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

An array of microscopic lenses integrated onto the surface of an image sensor pixel array to focus incident light onto the photosensitive area of each pixel.

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Product Specifications

Technical details and manufacturing context for Micro-lens Array

Definition
A micro-lens array is a critical optical component in modern image sensors, consisting of a precisely patterned grid of microscopic polymer or glass lenses. Each microlens corresponds to an individual pixel's photodiode. Its primary function is to collect and concentrate incoming light that would otherwise fall on non-photosensitive areas (like transistor circuitry and metal interconnects) and redirect it onto the active silicon photodiode region. This significantly increases the sensor's quantum efficiency, fill factor, and overall light sensitivity, which is essential for high-performance imaging in low-light conditions and for achieving higher resolution in compact camera modules.

In the manufacturing of image sensors, the micro-lens array is typically placed above the color filter array and planarization layer. The lenses are made from materials such as photosensitive resin (polymer), silicon dioxide (SiO₂), or silicon nitride (Si₃N₄). Key parameters include pitch (5–50 μm), lens diameter (5–50 μm), sag height (1–10 μm), focal length (5–100 μm), surface roughness (Ra ≤ 5 nm), form accuracy (PV ≤ 0.1 μm), transmittance (≥95%), operating temperature (-40–85 °C), storage temperature (-40–125 °C), relative humidity (≤85% RH), substrate thickness (200–1000 μm), and array size (1–20 mm). These values are typical ranges and must be verified for the specific model and application.

The micro-lens array is a component used in the assembly of image sensors. It is not a standalone product but is integrated into sensor modules. When selecting or specifying a micro-lens array, engineers must consider the pixel size, sensor stack thickness, and required optical performance. Verification of model-specific values and standards should be conducted with the legal manufacturer or supplier. The directory provides reference data only and does not imply certification or compliance.
Working Principle
Light incident on the image sensor surface first passes through the color filter array and then strikes the convex surface of each individual microlens in the array. Based on the principles of refraction, each microlens bends and focuses the light rays, concentrating them down through the planarization layer and onto the smaller, active area of the underlying photodiode. This process maximizes the amount of light captured by each pixel, improving the signal-to-noise ratio and the sensor's effective sensitivity.
Common Materials
Polymer (e.g., photosensitive resin), Silicon Dioxide (SiO₂), Silicon Nitride (Si₃N₄)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Pitch5–50 μmMatches pixel size; smaller pitch for higher resolution
Lens Diameter5–50 μmDetermines fill factor and light collection efficiency
Sag Height1–10 μmControls focal length; too low reduces focusing power
Focal Length5–100 μmMust match sensor stack thickness for optimal focus
Surface Roughness (Ra)≤5 nmLower roughness reduces scattering and improves transmission
Form Accuracy (PV)≤0.1 μmEnsures uniform focus across the array
Transmittance≥95 %Higher transmittance improves sensor sensitivity
Operating Temperature-40–85 °CMust withstand reflow soldering and field conditions
Storage Temperature-40–125 °CEnsures stability during shipping and storage
Relative Humidity≤85 %RHPrevents moisture absorption and delamination
MaterialSiO2, SiN, polymerChoice affects refractive index and durability
Substrate Thickness200–1000 μmMust match sensor package requirements
Array Size1–20 mmCovers typical sensor die sizes

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Lens Body Part
    The main convex optical element that refracts and focuses incident light.
    Material: Polymer or Silicon-based dielectric
  • Planarization Layer Part
    A flat, transparent layer beneath the microlenses that provides a smooth surface for lens formation and protects underlying layers.
    Material: Silicon Dioxide (SiO₂) or polymer

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Atmospheric pressure only (non-pressure rated)
other spec: Wavelength range: 400-1100 nm, Angular acceptance: ±15°
temperature: -40°C to +85°C (operational), -55°C to +125°C (storage)
Media Compatibility
✓ Visible light imaging ✓ Near-infrared sensing ✓ UV-cured optical adhesives
Unsuitable: High-energy particle radiation environments (e.g., nuclear facilities, space radiation belts)
Sizing Data Required
  • Pixel pitch (microns)
  • Required fill factor (%)
  • Target wavelength range (nm)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Lens surface contamination
Cause: Accumulation of dust, oil mist, or particulates from the operating environment, leading to reduced optical clarity and performance degradation.
Mechanical misalignment
Cause: Thermal expansion/contraction, vibration, or improper handling causing displacement of individual lenses, resulting in distorted output patterns.
Maintenance Indicators
  • Visible haze, spots, or discoloration on lens surfaces under inspection lighting
  • Irregular or distorted output patterns during functional testing
Engineering Tips
  • Implement controlled cleanroom environment with positive pressure and HEPA filtration to minimize particulate contamination
  • Use precision mounting fixtures with thermal compensation materials and vibration isolation to maintain optical alignment

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 10110-5:2015 (Optics and photonics - Preparation of drawings for optical elements and systems - Part 5: Surface form tolerances) ANSI/OP 1.001-2009 (American National Standard for Optics and Optical Instruments - Preparation of drawings for optical elements and systems) DIN 3140-7:2016 (Drawing indications for optical elements and systems - Part 7: Surface form tolerances)

Quoted from the published standard.

Manufacturing Precision
  • Lens pitch: +/- 0.5 μm
  • Surface roughness: Ra ≤ 10 nm
Quality Inspection
  • Interferometric surface profile measurement
  • Optical performance testing (MTF measurement)

Manufacturers of Micro-lens Array

Manufacturer profiles associated with Micro-lens Array.

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Frequently Asked Questions

What is the primary function of a micro-lens array?

The primary function is to focus incident light onto the photosensitive area of each pixel, increasing the sensor's quantum efficiency and light sensitivity.

What materials are commonly used for micro-lens arrays?

Common materials include photosensitive resin (polymer), silicon dioxide (SiO₂), and silicon nitride (Si₃N₄).

What are typical pitch and diameter ranges?

Typical pitch and lens diameter ranges are 5–50 μm, depending on pixel size and resolution requirements.

How should I verify specifications for a specific application?

Always confirm model-specific values such as focal length, transmittance, and temperature ranges with the legal manufacturer or supplier, as directory values are reference ranges.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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