Thermal interface material for heat dissipation in LED arrays
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Hardness | 20-80 Shore 00 | |
| Thickness | 0.5-5.0 mm | |
| Dielectric Strength | >5 kV/mm | |
| Thermal Conductivity | 1.5-12 W/mK | |
| Operating Temperature | -40°C to 200°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A modular assembly of multiple LED chips arranged in a specific pattern, designed as a replaceable component within a programmable lighting system.
Electronic control board that regulates power and signals to UV LEDs in an array
A modular assembly of multiple LED chips mounted on a substrate, forming the core light-emitting element of an LED luminaire.
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2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
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It reduces thermal resistance between LEDs and heat sinks, lowering junction temperatures to prevent efficiency loss and extend lifespan.
No, they are typically single-use due to material compression and potential degradation upon removal.
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