LED Luminaire
View system integration details
Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard LED Module/Array used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical LED Module/Array is characterized by the integration of LED Chips and Substrate/PCB. In industrial production environments, manufacturers listed on CNFX commonly emphasize Aluminum substrate construction to support stable, high-cycle operation across diverse manufacturing scenarios.
A modular assembly of multiple LED chips mounted on a substrate, forming the core light-emitting element of an LED luminaire.
Technical details and manufacturing context for LED Module/Array
Commonly used trade names and technical identifiers for LED Module/Array.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric (non-pressurized enclosure required) |
| other spec: | Max forward current: 350mA per chip, Max junction temperature: 125°C, IP rating: IP65+ for outdoor use |
| temperature: | -40°C to +85°C (operating), -40°C to +100°C (storage) |
Verified manufacturers with capability to produce this product in China
✓ 94% Supplier Capability Match Found
Authentic performance reports from verified B2B procurement managers.
"Standard OEM quality for Computer, Electronic and Optical Product Manufacturing applications. The LED Module/Array arrived with full certification."
"Great transparency on the LED Module/Array components. Essential for our Computer, Electronic and Optical Product Manufacturing supply chain."
"The LED Module/Array we sourced perfectly fits our Computer, Electronic and Optical Product Manufacturing production line requirements."
“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”
The LED module utilizes an aluminum substrate with copper circuit traces and thermal interface materials to efficiently dissipate heat, ensuring optimal performance and extended lifespan in demanding computer and optical applications.
Silicone encapsulation provides excellent protection against moisture, dust, and thermal stress, while maintaining optical clarity and flexibility. This enhances durability and reliability in industrial and electronic manufacturing environments.
Yes, the modular design allows for customization in LED chip configuration, phosphor coatings for color temperature adjustment, and substrate sizing to meet precise optical, brightness, and form factor needs in computer and optical product manufacturing.
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