Editorial Technical Reference

Infrared Source

This page explains how Infrared Source is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A component that emits infrared radiation for detection or measurement purposes.

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Product Specifications

Technical details and manufacturing context for Infrared Source

Definition
An infrared source is a critical component within sensor modules that generates infrared radiation, which is then used by infrared sensors for various applications such as temperature measurement, motion detection, gas analysis, and thermal imaging. This directory entry covers infrared sources as individual parts, not complete sensor systems. They are typically integrated into sensor modules by original equipment manufacturers (OEMs) or system integrators. The source operates by converting electrical energy into infrared radiation through thermal emission (incandescent sources) or electroluminescence (LEDs, lasers). The emitted radiation interacts with target objects or environments, and the reflected or transmitted radiation is detected by infrared sensors. Key parameters to consider when selecting an infrared source include wavelength, radiant power, forward voltage, forward current, rise time, beam angle, operating temperature, storage temperature, power dissipation, lens material, package type, and weight. For example, the peak emission wavelength typically ranges from 850 to 1550 nm, which must match the detector's spectral response. Radiant power at rated current is typically 5 to 50 mW, and forward voltage is 1.2 to 1.8 V. The forward current for continuous operation is 20 to 100 mA, and rise time for pulsed applications is 10 to 50 ns. Beam angle (full angle at half power) ranges from 10 to 120 degrees. Operating temperature range is -40 to 85 °C, and storage temperature is -40 to 100 °C. Maximum power dissipation at 25 °C is 50 to 200 mW. Lens material is typically glass or epoxy resin, and package type is often a hermetic metal can (TO-18). Weight depends on package and ranges from 0.5 to 2.0 g. Materials commonly used include tungsten filament, silicon carbide, and gallium arsenide. These values are typical ranges for directory reference; actual specifications must be confirmed with the legal manufacturer or supplier for the specific model and application. Always verify model-specific values and standards with the manufacturer or supplier before procurement.
Working Principle
Infrared sources convert electrical energy into infrared radiation. Incandescent sources use thermal emission: a tungsten filament or silicon carbide element is heated to high temperatures, emitting broadband infrared radiation. Semiconductor sources (LEDs or laser diodes) use electroluminescence: gallium arsenide or similar materials emit narrowband infrared when forward-biased. The emitted radiation is directed toward a target, and the reflected or transmitted radiation is detected by an infrared sensor. The source's wavelength, power, and beam angle must be matched to the sensor and application requirements.
Common Materials
Tungsten filament, Silicon carbide, Gallium arsenide
Technical Parameters
ParameterTypical rangeNotes & selection driver
Wavelength850–1550 nmPeak emission wavelength for detector matching
Radiant Power5–50 mWOutput power at rated current
Forward Voltage1.2–1.8 VAt rated forward current
Forward Current20–100 mAContinuous operation range
Rise Time10–50 nsFor pulsed applications
Beam Angle10–120 °Full angle at half power
Operating Temperature-40–85 °CAmbient temperature range
Storage Temperature-40–100 °CNon-operating storage
Power Dissipation50–200 mWMaximum allowable at 25°C
Lens MaterialGlassGlass or epoxy resin
Package TypeTO-18Hermetic metal can
Weight0.5–2.0 gDepends on package

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Emitter Element Part
    Generates infrared radiation through thermal or electroluminescent processes
    Material: Tungsten/Silicon carbide/Gallium arsenide
  • Reflector Part
    Directs and focuses the emitted infrared radiation
    Material: Aluminum/Coated glass
  • Electrical Contacts Part
    Provides electrical connection for power supply
    Material: Copper/Nickel plating
  • Housing Part
    Protects internal components and provides mechanical stability
    Material: Ceramic/Metal alloy

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 1 bar (atmospheric to slight positive pressure)
other spec: Wavelength range: 2-14 μm, Power consumption: 1-5W typical
temperature: -40°C to +85°C (operating), up to +125°C (peak)
Media Compatibility
✓ Clean dry air/nitrogen environments ✓ Non-corrosive gas streams ✓ Optical window materials (ZnSe, Ge, Si)
Unsuitable: High moisture/condensing environments or corrosive chemical atmospheres
Sizing Data Required
  • Required wavelength range (μm)
  • Target detection distance/application range
  • Required output power/radiant intensity

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Thermal degradation of emitter elements
Cause: Overheating due to inadequate cooling, excessive current, or prolonged operation beyond design limits, leading to reduced output or complete failure.
Optical window contamination or damage
Cause: Accumulation of dust, moisture, or chemical deposits on the window surface, or physical scratches from improper cleaning, causing signal attenuation or inaccurate readings.
Maintenance Indicators
  • Significant drop in output signal strength or inconsistent readings compared to baseline
  • Visible discoloration, cracks, or fogging on the infrared emitter or optical window
Engineering Tips
  • Implement regular cleaning of optical components using manufacturer-approved methods and materials to prevent contamination buildup
  • Ensure proper environmental control (temperature, humidity, and cleanliness) and verify cooling systems are functioning correctly to prevent thermal stress

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 20473:2007 (Optics and photonics - Spectral bands) ANSI Z136.1 (Safe Use of Lasers) CE Marking (EU Directive 2014/35/EU for electrical equipment)

Quoted from the published standard.

Manufacturing Precision
  • Wavelength Accuracy: +/- 5 nm
  • Output Power Stability: +/- 2% over 8 hours
Quality Inspection
  • Spectral Output Verification Test
  • Thermal Stability and Drift Test

Manufacturers of Infrared Source

Manufacturer profiles associated with Infrared Source.

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Frequently Asked Questions

What is the typical wavelength range for infrared sources?

The typical peak emission wavelength range is 850 to 1550 nm, as listed in the directory. The exact wavelength must be matched to the detector's spectral response for optimal performance. Confirm the specific wavelength with the manufacturer.

What are the common package types for infrared sources?

A common package type is the hermetic metal can TO-18. Other packages may be available, but the directory lists TO-18 as a typical option. The package affects mounting, thermal management, and environmental protection. Verify the package type for your application.

How do I choose between an incandescent and a semiconductor infrared source?

Incandescent sources (e.g., tungsten filament) provide broadband emission and are suitable for applications requiring a wide spectral range. Semiconductor sources (LEDs or lasers) offer narrowband emission, faster response, and higher efficiency. The choice depends on the application's wavelength, speed, and power requirements. Consult the manufacturer for guidance.

What are the typical operating temperature limits?

The operating temperature range is typically -40 to 85 °C, and storage temperature is -40 to 100 °C. Exceeding these limits may cause performance degradation or failure. Always operate within the specified range and verify with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
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