Rapid-pcb-prototyping
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This page explains how Laser Imaging Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision optical-electronic component that uses laser technology to create circuit patterns on photosensitive substrates during PCB prototyping.
Technical details and manufacturing context for Laser Imaging Module
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Wavelength | 405 ±5 nm | Determines resolution and photoresist compatibility |
| Output Power | 100–500 mW | Higher power increases throughput but may cause thermal drift |
| Scan Speed | 1000–5000 mm/s | Affects exposure time and productivity |
| Resolution | ±0.01 mm | Minimum feature size achievable |
| Repeatability | ±0.005 mm | Critical for multi-layer registration |
| Operating Temperature | 15–35 °C | Outside range may cause focus drift |
| Relative Humidity | 20–80 % RH | Condensation may damage optics |
| Input Voltage | 24 ±10% V DC | Stable supply required for consistent output |
| Power Consumption | 50–150 W | Includes laser driver and control electronics |
| IP Rating | IP54–IP65 | Protects against dust and water jetsIEC 60529 |
| Weight | 2.5–5.0 kg | Affects mounting and gantry design |
| Laser Class | 3B–4 | Safety requirements for operationIEC 60825-1 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Laser Imaging Module.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric (sealed optical path, no pressure rating required) |
| other spec: | Humidity: 30-70% RH non-condensing, Laser Power Stability: ±1%, Positioning Accuracy: ±5μm |
| temperature: | 15-35°C (operating), 5-45°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Laser Imaging Module.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The typical wavelength is 405 ±5 nm, which is in the UV/blue range. This wavelength is compatible with many photoresists used in PCB prototyping. However, the exact wavelength should be confirmed with the manufacturer for your specific application.
The resolution is specified as ±0.01 mm, meaning the minimum feature size that can be reliably produced is around 10 micrometers. This is suitable for fine-pitch prototyping. Actual resolution may vary depending on the optical setup and material.
The module is designed to operate in temperatures from 15 to 35 °C and relative humidity from 20% to 80% RH. Operating outside these ranges may cause focus drift or condensation, which can damage optics. Ensure the environment is controlled.
The laser class is 3B to 4 according to IEC 60825-1. These are high-power lasers that require safety precautions, such as protective eyewear and interlocks. Always follow the manufacturer's safety guidelines and local regulations.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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