Editorial Technical Reference

Network Interface Controller

This page explains how Network Interface Controller is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A hardware component that manages network connectivity and data transmission between a multi-core processor and external networks.

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Product Specifications

Technical details and manufacturing context for Network Interface Controller

Definition
Within a Multi-Core Analysis Processor, the Network Interface Controller (NIC) serves as the dedicated hardware interface responsible for establishing, maintaining, and controlling the physical and data link layer connections to a computer network. It handles the reception and transmission of data packets, offloading network processing tasks from the main processor cores to enable efficient parallel data analysis and high-speed communication with other systems, storage, or data sources. The NIC operates by converting data from the processor's internal bus into electrical signals suitable for transmission over a network medium (e.g., Ethernet cable, fiber). It implements protocols like Ethernet, managing frame construction, error checking via CRC, and media access control (MAC). It typically includes a dedicated processor, memory buffers, and a PHY (physical layer) chip to handle signal modulation and physical connection. The NIC is available in various configurations, with data rates from 1 to 100 Gbps (IEEE 802.3), interface types PCIe 3.0/4.0 (x4 or x8 slots), and port counts from 1 to 4. Operating temperature ranges from 0 to 70°C (industrial grade extends to -40 to 85°C), storage temperature from -40 to 85°C, and operating humidity from 10 to 90% RH (non-condensing). Supply voltage is 3.3 V DC ±5% (derived from PCIe slot), power consumption from 5 to 15 W, MTBF from 50,000 to 100,000 hours (Telcordia SR-332), dimensions from 120×68 to 180×120 mm, and weight from 50 to 200 g. Materials include silicon, copper, and plastic. These values are directory reference ranges; verify model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The NIC converts data from the processor's internal bus into electrical signals for network transmission. It implements Ethernet protocols, managing frame construction, error checking via CRC, and media access control. It includes a dedicated processor, memory buffers, and a PHY chip for signal modulation and physical connection. The NIC offloads network processing from the main CPU, enabling efficient parallel data analysis and high-speed communication.
Common Materials
Silicon (for integrated circuits), Copper (for traces and connectors), Plastic (for housing/connectors)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Data Rate1–100 GbpsHigher rates require PCIe 4.0 or aboveIEEE 802.3
Interface TypePCIe 3.0/4.0Compatible with x4 or x8 slotsPCIe Base Spec
Port Count1–4More ports increase throughput and redundancy
Operating Temperature0–70 °CIndustrial grade extends to -40–85°CIEC 60068-2-1/2
Storage Temperature-40–85 °CExceeding may damage componentsIEC 60068-2-1/2
Operating Humidity10–90 %RHNon-condensingIEC 60068-2-78
Supply Voltage3.3 ±5% V DCDerived from PCIe slotPCIe CEM
Power Consumption5–15 WDepends on port count and data rate
MTBF50000–100000 hHigher is better for reliabilityTelcordia SR-332
Dimensions120×68–180×120 mmHalf-height and full-height brackets available
Weight50–200 gVaries with heatsink and bracket

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • MAC Controller
    Manages data link layer protocols, frame assembly/disassembly, and error checking.
    Material: Silicon (integrated circuit)
  • PHY (Physical Layer) Chip
    Handles analog signal modulation/demodulation and physical medium attachment.
    Material: Silicon (integrated circuit)
  • Buffer Memory Part
    Temporarily stores incoming and outgoing data packets to manage speed differences.
    Material: Silicon (SRAM/DRAM)
  • Bus Interface Controller
    Manages communication with the processor via the internal bus (e.g., PCIe).
    Material: Silicon (integrated circuit)
  • Connector (e.g., RJ45 Port) Part
    Provides physical connection point for network cables.
    Material: Copper alloy, plastic
  • Dedicated Processor
    Runs the network stack on the card so the host CPU does not have to.
    Material: Silicon

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (solid-state component)
other spec: Data Rate: 1 Gbps to 100 Gbps, Power Consumption: 1W to 15W
temperature: 0°C to 70°C (operational), -40°C to 85°C (storage)
Media Compatibility
✓ Ethernet networks (copper/fiber) ✓ Data center server environments ✓ Industrial automation systems
Unsuitable: High-voltage electrical environments with EMI interference
Sizing Data Required
  • Network bandwidth requirements (Gbps)
  • Processor interface type (PCIe version/lanes)
  • Operating system/driver compatibility

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Overheating and thermal degradation
Cause: Inadequate cooling due to dust accumulation, poor airflow in server/rack, or excessive ambient temperature leading to solder joint fatigue, capacitor failure, or chip damage.
Electrical overstress (EOS) and electrostatic discharge (ESD)
Cause: Power surges, improper grounding, or human handling without ESD protection damaging sensitive semiconductor components, particularly during installation or maintenance.
Maintenance Indicators
  • Intermittent or complete loss of network connectivity despite functional cables and switches
  • Abnormal heat emission from the NIC or adjacent components, often detectable by touch or thermal imaging
Engineering Tips
  • Implement regular cleaning of server/rack cooling systems and maintain ambient temperature below manufacturer specifications (typically 35°C) to prevent thermal stress.
  • Use ESD-safe procedures during handling/installation and ensure proper power conditioning/UPS protection to guard against electrical transients.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO/IEC 11801: Information technology - Generic cabling for customer premises ANSI/TIA-568.2-D: Balanced Twisted-Pair Telecommunications Cabling and Components Standards CE Marking: Compliance with EU EMC Directive 2014/30/EU and Low Voltage Directive 2014/35/EU

Quoted from the published standard.

Manufacturing Precision
  • Connector Pin Alignment: +/-0.05mm
  • PCB Trace Impedance: +/-10% of nominal value (typically 50Ω or 100Ω)
Quality Inspection
  • Bit Error Rate Test (BERT) for signal integrity validation
  • Electromagnetic Compatibility (EMC) Testing for emissions and immunity

Manufacturers of Network Interface Controller

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Frequently Asked Questions

What is the typical data rate range for this NIC?

The directory lists a data rate range of 1 to 100 Gbps, based on IEEE 802.3 standards. Higher rates require PCIe 4.0 or above. Confirm the exact rate supported by the specific model with the manufacturer.

What interface types are available?

The NIC supports PCIe 3.0 or 4.0, compatible with x4 or x8 slots. The interface type affects bandwidth and compatibility with the host system. Verify the slot configuration with the manufacturer.

What are the operating temperature limits?

The standard operating temperature range is 0 to 70°C, with industrial grade extending to -40 to 85°C. Storage temperature is -40 to 85°C. These are reference ranges; check the specific model's datasheet.

How many ports does this NIC have?

The port count ranges from 1 to 4. More ports increase throughput and redundancy. The exact number depends on the model; verify with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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