Switching Matrix
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This page explains how PCB Backplane is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board that provides electrical and mechanical interconnections between multiple daughterboards or modules in a switching matrix system.
Technical details and manufacturing context for PCB Backplane
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Board Thickness | 1.6–6.35 mm | Thicker for higher layer count and mechanical rigidityIPC-6012 |
| Layer Count | 4–30 layers | Higher for complex routing and signal integrity |
| Copper Weight | 0.5–3 oz | Heavier for high current capacityIPC-6012 |
| Minimum Trace Width/Space | 0.075–0.15 mm | Tighter for high-density interconnectIPC-2221 |
| Impedance Tolerance | ±10 % | Critical for high-speed signal integrityIPC-2141 |
| Maximum Current Capacity | 2–10 A | Depends on copper weight and trace widthIPC-2221 |
| Operating Temperature | -40–85 °C | Beyond range may affect reliabilityIPC-6012 |
| Dielectric Withstanding Voltage | 500–1500 V DC | Ensures insulation integrityIPC-6012 |
| Insulation Resistance | 10^9–10^12 Ω | Minimum at 25°C, 60% RHIPC-6012 |
| Surface Finish | ENIG, HASL, OSP | ENIG for flatness and shelf lifeIPC-4552 |
| Board Dimensions (Max) | 600×600 mm | Limited by manufacturing capability |
| Weight | 0.5–5 kg | Depends on size and layer count |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | N/A (non-fluidic) |
| other spec: | Max current per trace: 3A, Max voltage: 600V, Signal frequency: up to 10GHz |
| temperature: | -40°C to +85°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The layer count can range from 4 to 30 layers, depending on the complexity of routing and signal integrity requirements. Higher layer counts are used for more complex systems.
Common materials include FR-4 epoxy laminate as the base, copper foil for traces, and gold-plated connectors for reliable electrical contact. Surface finishes may be ENIG, HASL, or OSP.
Relevant standards include IPC-6012 for performance, IPC-2221 for design, IPC-2141 for impedance control, and IPC-4552 for ENIG finish. These are reference standards; compliance must be verified with the manufacturer.
You should consult the manufacturer or supplier for the specific model's datasheet. Verify parameters such as board thickness, layer count, copper weight, impedance tolerance, and operating temperature against your system requirements.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
Compare manufacturer profiles with relevant product and process capability.