Editorial Technical Reference

Transducer Array

This page explains how Transducer Array is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A structured arrangement of multiple transducer elements designed to emit and receive ultrasonic signals in a coordinated manner.

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Product Specifications

Technical details and manufacturing context for Transducer Array

Definition
Within a Probe Generator, the Transducer Array serves as the core sensing and signal generation component. It consists of multiple piezoelectric elements arranged in specific patterns (linear, phased, matrix) that work collectively to produce controlled ultrasonic beams for non-destructive testing, medical imaging, or measurement applications. The array enables beam steering, focusing, and scanning capabilities that individual transducers cannot achieve. This directory entry describes the generic component class; actual models vary in element count, frequency, and housing. The array is typically integrated into a probe housing with an acoustic matching layer and backing material to optimize performance. Electrical connections are made via standard connectors (Micro-D or SMA) for system integration. The number of elements ranges from 16 to 256, determining resolution and field of view. Operating frequency spans 1–10 MHz, with higher frequencies improving resolution but reducing penetration. Element pitch should be ≤ half wavelength to avoid grating lobes, typically 0.1–1.0 mm. Relative bandwidth at -6 dB is 60–80%. Capacitance per element is 50–500 pF, affecting electrical matching. Impedance is 50–100 Ω for typical system integration. Operating temperature range is -20 to 70 °C; storage temperature is -40 to 85 °C. IP rating (IEC 60529) is IP54–IP67 for industrial environments. Housing material is aluminum or stainless steel for corrosion resistance and durability. Weight ranges from 50 to 500 g depending on element count and housing. Always verify model-specific values and standards with the legal manufacturer or supplier before procurement or integration.
Working Principle
Electrical energy is converted to mechanical vibrations (ultrasound) via the piezoelectric effect in each array element. These elements are excited with precise timing delays to create constructive interference patterns, forming directed ultrasonic beams. Returning echoes are converted back to electrical signals for processing. Beam steering and focusing are achieved by adjusting the delay pattern, enabling electronic scanning without moving parts.
Common Materials
Piezoelectric ceramic (PZT), Backing material, Acoustic matching layer, Electrode materials
Technical Parameters
ParameterTypical rangeNotes & selection driver
Number of Elements16–256Determines resolution and field of view
Operating Frequency1–10 MHzHigher frequency improves resolution but reduces penetration
Element Pitch0.1–1.0 mmShould be ≤ half wavelength to avoid grating lobes
Bandwidth60–80 %Relative bandwidth at -6 dB
Capacitance per Element50–500 pFAffects electrical matching
Impedance50–100 ΩTypical for system integration
Operating Temperature-20–70 °COutside this range performance degrades
Storage Temperature-40–85 °CNon-operating limit
IP RatingIP54–IP67For industrial environmentsIEC 60529
Housing MaterialAluminum/Stainless SteelCorrosion resistance and durability
Weight50–500 gDepends on element count and housing
Connector TypeMicro-D / SMACompatibility with system cabling

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Piezoelectric Element Part
    Converts electrical signals to mechanical vibrations and vice versa
    Material: Lead zirconate titanate (PZT) ceramic
  • Electrode Part
    Provides electrical connection to piezoelectric elements
    Material: Silver or gold plating
  • Acoustic Matching Layer Part
    Improves acoustic impedance matching between transducer and medium
    Material: Epoxy composite with tungsten powder
  • Backing Block Part
    Damps vibrations and controls pulse duration
    Material: Epoxy with heavy metal powder

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0 to 100 bar
flow rate: 0 to 10 m/s
temperature: -40°C to 150°C
slurry concentration: 0 to 30% solids by weight
Media Compatibility
✓ Water-based liquids ✓ Oil-based fluids ✓ Chemical solutions
Unsuitable: High-viscosity slurries with abrasive particles
Sizing Data Required
  • Required frequency range (kHz)
  • Beam angle specification (degrees)
  • Array element spacing (mm)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Signal drift or attenuation
Cause: Degradation of piezoelectric elements due to thermal cycling, moisture ingress, or mechanical stress, leading to inconsistent output or loss of sensitivity.
Mechanical damage to array housing
Cause: Impact, vibration, or corrosion compromising structural integrity, which can misalign elements or expose internal components to environmental hazards.
Maintenance Indicators
  • Inconsistent or erratic readings across multiple elements during routine calibration checks
  • Visible cracks, corrosion, or fluid ingress on the transducer housing or mounting surfaces
Engineering Tips
  • Implement regular calibration and environmental sealing inspections to prevent moisture and contamination, using manufacturer-recommended procedures and materials.
  • Ensure proper mounting and isolation from excessive vibration or thermal shock, following installation guidelines to minimize mechanical and thermal stress on the array.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 18563-1:2015 (Non-destructive testing - Ultrasonic testing - Characterization and verification of ultrasonic transducer arrays) ANSI/ASME B46.1-2019 (Surface Texture, Surface Roughness, Waviness, and Lay) DIN EN 12668-1:2010 (Non-destructive testing - Characterization and verification of ultrasonic examination equipment - Part 1: Instruments)

Quoted from the published standard.

Manufacturing Precision
  • Element pitch accuracy: +/-0.01mm
  • Acoustic impedance uniformity: +/-5% across array
Quality Inspection
  • Acoustic beam profile verification (using hydrophone or reference block)
  • Electrical impedance matching test (for each array element)

Manufacturers of Transducer Array

Manufacturer profiles associated with Transducer Array.

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Frequently Asked Questions

What is the typical number of elements in a transducer array?

The number of elements typically ranges from 16 to 256, depending on the application. Higher element counts provide better resolution and field of view but increase complexity and cost.

How does operating frequency affect performance?

Higher frequencies (up to 10 MHz) improve resolution but reduce penetration depth. Lower frequencies (down to 1 MHz) penetrate deeper but with lower resolution. The optimal frequency depends on the material and inspection requirements.

What is the significance of element pitch?

Element pitch is the distance between adjacent elements. It should be ≤ half the wavelength to avoid grating lobes, which are unwanted side lobes that can cause artifacts. Typical pitch values are 0.1–1.0 mm.

What environmental ratings are available?

The IP rating (per IEC 60529) ranges from IP54 to IP67, indicating protection against dust and water. IP54 is splash-proof, while IP67 is dust-tight and protected against temporary immersion. Verify the specific rating for your model.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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