Hardener system for electrical grade epoxy resin compounds that initiates cross-linking polymerization for permanent insulation properties.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Color | Amber to dark brown | |
| Gel Time | 45-180 minutes at 80°C | |
| Pot Life | 30-120 minutes at 25°C | |
| Mix Ratio | 100:20-100:50 (resin:hardener) | |
| Viscosity | 200-800 mPa·s at 25°C | |
| Amine Value | 200-400 mg KOH/g | |
| Cure Schedule | 2-4 hours at 100-150°C | |
| Moisture Content | <0.1% | |
| Specific Gravity | 1.05-1.25 g/cm³ |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
Manufacturer profiles associated with Hardener System.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
Electrical grade hardeners are specifically formulated with ultra-low ionic impurities (<50 ppm chloride, <10 ppm sodium), controlled dielectric properties (εr 3.0-4.0), and superior thermal stability (>150°C) to prevent electrical tracking, partial discharge, and thermal degradation in high-voltage applications.
Hardener chemistry directly determines dielectric strength (15-25 kV/mm), dissipation factor (<0.01 at 1 MHz), volume resistivity (>10¹⁴ Ω·cm), and glass transition temperature (Tg 100-180°C). Anhydride hardeners typically provide better high-temperature performance while amine hardeners offer faster curing.
Store in sealed containers at 15-25°C with <40% relative humidity, protected from moisture absorption. Shelf life is typically 6-12 months. Moisture-contaminated hardeners can cause incomplete curing, reduced dielectric strength, and void formation.
Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.