Heat sink for dissipating thermal energy from high-fidelity audio amplifier components to maintain optimal operating temperatures.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Weight | 50-300 g | |
| Fin Density | 4-12 fins/inch | |
| Surface Area | 200-800 cm² | |
| Base Thickness | 3-8 mm | |
| Mounting Pressure | 5-15 psi | |
| Thermal Resistance | 0.5-2.5 °C/W |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
This product is a specialized printed circuit board (PCB) assembly designed to amplify low-power audio signals to drive speakers in consumer electronics.
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