INDUSTRY COMPONENT

Lower Mold Plate

Lower mold plate is the stationary base component in injection molding and die casting machines that supports the mold cavity and provides structural stability.

Component Specifications

Definition
The lower mold plate, also known as the stationary platen or bottom plate, is a critical structural component in mold assemblies for plastic injection molding, die casting, and compression molding processes. It serves as the foundation that securely holds the stationary half of the mold (typically the cavity side), provides mounting points for the entire mold assembly to the machine bed, and ensures precise alignment with the moving platen during operation. This component must withstand significant clamping forces, thermal expansion stresses, and repeated cycling while maintaining dimensional stability and alignment accuracy.
Working Principle
The lower mold plate operates as the fixed reference point in the mold assembly system. During machine operation, it remains stationary while the upper mold plate moves to close the mold. It provides: 1) Structural support for the mold cavity and core components, 2) Precise alignment through guide pins and bushings, 3) Thermal management through integrated cooling channels, 4) Force distribution to handle clamping pressures up to thousands of tons, and 5) Mounting interface for ejection systems and auxiliary equipment.
Materials
Typically manufactured from high-strength, pre-hardened steel alloys such as P20 (1.2311), H13 (1.2344), or 4140 steel. Common specifications include: hardness 28-32 HRC (P20) or 48-52 HRC (H13), tensile strength 900-1200 MPa, yield strength 700-1000 MPa, with excellent machinability and thermal stability. Premium applications may use stainless steels (420, 440C) or beryllium copper for specific thermal/conductivity requirements.
Technical Parameters
ParameterTypical rangeNotes & selection driver
Hardness28-52 HRC (material dependent)
Parallelism0.03 mm maximum deviation
Surface FinishRa 0.8-1.6 μm
Weight Capacity2-20 tons
Flatness Tolerance±0.02 mm/m
Standard Thickness50-300 mm
Maximum Load Capacity500-5000 tons (machine dependent)
Thermal Expansion Coefficient11.5-13.0 × 10⁻⁶/°C

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards
ISO 12165, DIN 16760, ISO 8015, DIN 7167

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Thermal fatigue cracking
  • Warping from uneven heating
  • Guide pin/bushing wear leading to misalignment
  • Stress corrosion in cooling channels
  • Fatigue failure from cyclic loading
  • Surface pitting from chemical exposure
FMEA Triads
Trigger: Inadequate cooling channel design causing thermal stress concentration
Failure: Thermal fatigue cracks propagating from cooling channels
Mitigation: Implement optimized cooling channel layout with smooth transitions, use finite element analysis for thermal stress simulation, apply surface treatments to improve fatigue resistance
Trigger: Improper clamping force distribution
Failure: Plate warping or permanent deformation
Mitigation: Design with sufficient thickness and ribbing, use multiple clamping points with even force distribution, implement strain gauges for force monitoring during setup
Trigger: Corrosive coolant or processing materials
Failure: Pitting and erosion in cooling channels and mounting surfaces
Mitigation: Use corrosion-resistant materials or coatings, implement proper coolant filtration and treatment, establish regular cleaning and inspection protocols

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance
Geometric tolerances per ISO 2768-mK, flatness ≤ 0.05 mm/m, parallelism ≤ 0.03 mm, positional tolerance ±0.02 mm for mounting holes
Test Method
Coordinate measuring machine (CMM) verification, surface plate inspection with dial indicators, ultrasonic testing for internal defects, hardness testing with Rockwell scale, dye penetrant testing for surface cracks

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Lower Mold Plate

Manufacturer profiles associated with Lower Mold Plate.

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Frequently Asked Questions

What is the difference between lower mold plate and moving platen?

The lower mold plate remains stationary during operation and supports the cavity side of the mold, while the moving platen travels to open and close the mold, typically carrying the core side. The lower plate provides the fixed reference point for alignment and mounting.

How often should lower mold plates be inspected for wear?

Regular visual inspections should occur every 500-1000 cycles, with comprehensive dimensional checks every 10,000-50,000 cycles depending on operating conditions. Critical wear points include guide pin holes, mounting surfaces, and cooling channel connections.

Can lower mold plates be repaired if damaged?

Minor surface damage can often be repaired through machining and resurfacing, but structural cracks or significant warping typically require replacement. Repair feasibility depends on material type, extent of damage, and original heat treatment.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

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