This page explains how Backplane is classified within Machinery and Equipment Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A printed circuit board that provides electrical and mechanical connections for multiple modules in a Programmable Logic Controller (PLC) rack.
Technical details and manufacturing context for Backplane
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Number of Slots | 4–12 | Determines module capacity |
| Backplane Width | 100–300 mm | Fits rack dimensions |
| Backplane Height | 80–200 mm | Standard 19-inch rack compatible |
| Rated Current per Pin | 1–10 A | Higher current requires larger pinIEC 60664 |
| Rated Voltage | 24–250 V AC/DC | Insulation coordination per standardIEC 60664 |
| Contact Resistance | ≤20 mΩ | Lower is better for signal integrityIEC 60512 |
| Insulation Resistance | ≥100 MΩ | At 500 V DCIEC 60243 |
| Dielectric Withstand Voltage | 1500–3000 V AC | For 1 minute, no breakdownIEC 60243 |
| Operating Temperature | -40–85 °C | Extended range for industrialIEC 60068 |
| Storage Temperature | -40–105 °C | Non-operatingIEC 60068 |
| Relative Humidity | 5–95 % RH | Non-condensingIEC 60068 |
| IP Rating | IP20–IP65 | Higher for harsh environmentsIEC 60529 |
| Base Material | FR-4 | Glass epoxy, UL 94V-0IPC-4101 |
| Copper Thickness | 35–70 μm | Heavier copper for high currentIPC-6012 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | N/A (non-pressurized electrical component) |
| other spec: | Humidity: 5% to 95% non-condensing, Vibration: 5-500 Hz at 2G, Shock: 50G for 11ms |
| temperature: | -40°C to +85°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Backplane.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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A PLC backplane provides the mechanical and electrical interface for mounting and interconnecting PLC modules such as CPU, I/O, and power supplies. It distributes power and enables communication between modules.
Common materials include FR-4 glass epoxy as the base, copper for conductive traces, and gold or tin plating on connectors to ensure reliable contact.
Typical ratings include rated current per pin from 1 to 10 A, rated voltage from 24 to 250 V AC/DC, contact resistance ≤20 mΩ, and insulation resistance ≥100 MΩ at 500 V DC. Always verify with the manufacturer.
Relevant standards include IEC 60664 for insulation coordination, IEC 60512 for contact resistance, IEC 60243 for dielectric withstand, IEC 60068 for environmental conditions, and IPC-4101/6012 for materials. Compliance must be confirmed for the specific product.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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