High-Speed Memory Module

Product Specifications

Technical details and manufacturing context for High-Speed Memory Module

Definition

A high-speed memory module is a critical component in computer manufacturing that provides volatile data storage for processors. It consists of multiple memory chips mounted on a printed circuit board with standardized connectors for system integration. These modules enable rapid data access and processing in servers, workstations, and consumer computing devices. Manufacturers integrate them into motherboards as essential sub-assemblies for system performance optimization. The module's design follows JEDEC standards for dimensions, pinouts, and electrical interfaces, ensuring compatibility across a wide range of systems. Key parameters include memory capacity ranging from 8 to 64 GB, data rates from 3200 to 6400 MT/s per JEDEC DDR5 specifications, CAS latency from 16 to 40 cycles, and operating voltage from 1.1 to 1.35 V. Physical characteristics include a module height of 31.25 mm, PCB thickness from 1.2 to 1.6 mm, gold plating thickness from 0.05 to 0.15 μm, and weight from 15 to 25 g. The module operates within a temperature range of 0 to 85 °C and can be stored from -40 to 100 °C, with relative humidity from 10% to 90% non-condensing. It features a 288-pin DIMM interface compliant with JEDEC DDR4/DDR5 standards. Materials include FR-4 PCB substrate, DRAM silicon chips, and gold-plated copper contacts. These modules are used in various computing environments, and their performance must be verified against the specific requirements of the target system. Always confirm model-specific values and standards with the legal manufacturer or supplier before procurement.

Working Principle

Memory chips store data as electrical charges in capacitors, with controller logic managing read/write operations through synchronized clock signals and data buses. The module's controller interprets commands from the system's memory controller, activates the appropriate rows and columns in the DRAM arrays, and transfers data to and from the data bus. The clock signal synchronizes all operations, ensuring data integrity. The module's design includes termination and signal integrity features to maintain reliable operation at high speeds.

Common Materials

FR-4 PCB substrate, DRAM silicon chips, Gold-plated copper contacts

Technical Parameters

Parameter	Typical range	Notes & selection driver
Memory CapacityRequired	8–64 GB	Total storage capacity in gigabytes
Data RateRequired	3200–6400 MT/s	Mega transfers per secondJEDEC DDR5
CAS LatencyRequired	16–40 CL	Column address strobe latency cycles
Operating VoltageRequired	1.1–1.35 V	Standard operating voltageJEDEC
Module Height	31.25 mm	Physical height of the moduleJEDEC MO-309
Operating Temperature	0–85 °C	Extended temperature range for industrial useJEDEC
Storage Temperature	-40–100 °C	Non-operating condition
Relative Humidity	10–90 %	Non-condensing
PCB Thickness	1.2–1.6 mm	Affects mechanical strength and thermal performanceIPC-6012
Gold Plating Thickness	0.05–0.15 μm	Ensures reliable contact and corrosion resistanceIPC-4552
Weight	15–25 g	Varies with capacity and heat sink
Pin Count	288 pins	Standard DIMM interfaceJEDEC DDR4/DDR5

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Memory ICs Part
Data storage cells

Material: Silicon semiconductor
PCB Substrate Part
Circuit board foundation

Material: FR-4 laminate
SPD Chip Part
Serial presence detection

Material: EEPROM silicon
Edge Connector Part
Electrical interface to motherboard

Material: Gold-plated copper alloy

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for High-Speed Memory Module.

Manufacturers of High-Speed Memory Module

Manufacturer profiles associated with High-Speed Memory Module.

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Frequently Asked Questions

What is the memory capacity range of this module?

The directory lists a capacity range of 8 to 64 GB. However, actual capacity depends on the specific model and configuration. Always verify with the manufacturer.

What data rates does this module support?

The data rate range is 3200 to 6400 MT/s, referencing JEDEC DDR5 standards. Confirm the exact data rate for the specific module variant.

What is the operating temperature range?

The operating temperature range is 0 to 85 °C, as listed. For industrial applications, ensure the module meets the required thermal specifications.

Is this module compatible with DDR4 or DDR5 systems?

The module has a 288-pin DIMM interface and references JEDEC DDR4/DDR5 standards. Compatibility depends on the system's memory controller and voltage requirements. Check with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	Atmospheric pressure only (not pressure-sensitive)
other spec:	Voltage: 1.2V-1.35V (DDR4), 1.1V (DDR5); Clock Speed: 1600-6400 MHz; Humidity: 5-95% non-condensing
temperature:	0°C to 85°C (operating), -40°C to 100°C (storage)

Product Specifications

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