This page explains how Surface Mount Technology (SMT) Line is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
An automated assembly line for mounting electronic components directly onto printed circuit boards (PCBs).
Technical details and manufacturing context for Surface Mount Technology (SMT) Line
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Placement SpeedRequired | 30000–80000 components per hour (CPH) | The maximum number of components the line can place in one hour. |
| Placement AccuracyRequired | ±0.05 micrometers (µm) | The precision with which components are positioned on the PCB, typically measured as a deviation from the target location. |
| Minimum Component SizeRequired | 01005 millimeters (mm) | The smallest surface-mount component (e.g., 0201, 01005) the line's pick-and-place machine can handle. |
| Maximum PCB SizeRequired | 510 x 460 millimeters (mm) | The largest dimensions (length x width) of a printed circuit board the conveyor system can accommodate. |
| Number of Placement Heads | 2–12 count | The quantity of independent robotic heads on the pick-and-place machine, affecting simultaneous placement capability. |
| PCB Thickness | 0.4–4.0 mm | Typical range for rigid boards. |
| Component Height | 0.2–25 mm | Max height for placement and clearance. |
| Power Supply | 380 ±10% V AC | Three-phase; other voltages on request. |
| Air Consumption | 100–300 L/min | At 0.5 MPa supply pressure. |
| Operating Temperature | 15–35 °C | For optimal accuracy and reliability. |
| Relative Humidity | 30–70 %RH | Non-condensing. |
| Machine Weight | 1500–3000 kg | Depends on configuration and number of heads. |
| Footprint | 2.5 x 1.5–4.0 x 2.0 m | Length x width; varies with model. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | 0.4-0.8 MPa (pneumatic systems), 50-100 kPa (vacuum pick-and-place) |
| other spec: | Humidity: 40-60% RH, PCB size: 50x50mm to 450x450mm, Component size: 0201 to 45x45mm QFP, Placement accuracy: ±0.025mm, Throughput: 10,000-100,000 CPH |
| temperature: | 15-30°C (operating environment), 150-300°C (reflow soldering zone) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
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The placement speed is typically in the range of 30,000 to 80,000 components per hour (CPH), depending on the configuration and number of placement heads. Confirm the exact value for the specific model.
The minimum component size is 01005 (metric), which is approximately 0.4 mm x 0.2 mm. This capability depends on the pick-and-place machine's precision and feeder system.
The line typically requires a three-phase power supply of 380 V AC ±10% and compressed air at 0.5 MPa with consumption of 100–300 L/min. Verify these requirements with the supplier for your installation.
For optimal accuracy and reliability, the operating temperature should be between 15 and 35 °C, and relative humidity between 30% and 70% RH (non-condensing). Ensure the facility meets these conditions.
Commonly used trade names and technical identifiers for Surface Mount Technology (SMT) Line.
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