This page explains how Forging-Grade Copper Alloy Billet is classified within Metal Forging, Pressing, Stamping. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Forging-grade copper alloy billet is a semi-finished industrial material specifically formulated for hot forging processes.
Technical details and manufacturing context for Forging-Grade Copper Alloy Billet
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Copper ContentRequired | ≥99.90 % | Minimum copper percentage in alloy compositionASTM B124 |
| Forging Temperature RangeRequired | 750–950 °C | Optimal temperature range for hot forging operations |
| Yield StrengthRequired | ≥200 MPa | Minimum yield strength at room temperatureASTM B124 |
| Thermal ConductivityRequired | 385–400 W/m·K | Heat transfer capability at 20°C |
| Billet Diameter Tolerance | ±0.5 mm | Allowable variation from nominal diameterGB/T 1804 |
| Grain Size | 0.015–0.045 μm | Average grain diameter in microstructureASTM E112 |
| Billet Length | 500–6000 mm | Custom lengths available |
| Density | 8.9–8.94 g/cm³ | Near pure copper |
| Electrical Conductivity | ≥100 % IACS | High for electrical applicationsASTM E1004 |
| Hardness (Brinell) | 35–60 HB | As-forged conditionASTM E10 |
| Surface Quality | ≤0.2 mm | Max defect depthGB/T 14956 |
| Straightness | ≤1.5 mm/m | For automated forgingGB/T 1804 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Forging-Grade Copper Alloy Billet.
| pressure: | Up to 1000 MPa (typical forging press capacity) |
| other spec: | Billet diameter tolerance: ±1.5%, Surface finish: ≤25 μm Ra, Grain size: ASTM 5-8 |
| temperature: | 750-950°C (hot forging range) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Forging-Grade Copper Alloy Billet.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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The recommended hot forging temperature range is 750–950°C. However, the exact temperature should be optimized based on the specific alloy composition and the complexity of the forged part. Always consult the material supplier or manufacturer for precise process parameters.
The listed standards include ASTM B124 for copper content and yield strength, GB/T 1804 for diameter tolerance and straightness, ASTM E112 for grain size, ASTM E1004 for electrical conductivity, ASTM E10 for hardness, and GB/T 14956 for surface quality. These are reference standards for verification; they do not guarantee compliance unless confirmed by the supplier.
Yes, the minimum electrical conductivity of 100% IACS indicates suitability for electrical applications. However, the final component's conductivity may be affected by the forging process and subsequent heat treatment. Verify the required conductivity with the manufacturer.
The maximum defect depth is 0.2 mm as per GB/T 14956. This ensures surface quality suitable for forging. For critical applications, additional surface inspection may be required.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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