Heat sink interface for thermal dissipation in polycarbonate injection molded lens housings
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Surface Flatness | ≤0.05 mm | |
| Mounting Pressure | 15-25 psi | |
| Interface Thickness | 0.5-3.0 mm | |
| Thermal Conductivity | ≥200 W/m·K | |
| Operating Temperature | -40°C to +150°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
This precision injection molded component is designed to house and protect optical elements in industrial applications.
Power semiconductor components (IGBTs/SCRs) for high-voltage, high-current switching and control in industrial applications.
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The primary function is to efficiently transfer heat from internal components to the heat sink, preventing thermal damage and maintaining optimal performance of optical elements.
Material selection directly impacts thermal conductivity, corrosion resistance, and mechanical stability. Aluminum offers good conductivity with lightweight properties, while copper provides superior conductivity but with higher weight and cost.
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