A ceramic substrate is a thin, flat ceramic plate used as a base for mounting and interconnecting electronic components in surface mount technology.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Thickness | 0.25 mm to 1.0 mm | |
| Surface Roughness | <0.5 μm Ra | |
| Dielectric Strength | >10 kV/mm | |
| Thermal Conductivity | 20-180 W/mK | |
| Operating Temperature | -55°C to +150°C | |
| Coefficient Of Thermal Expansion | 6-8 ppm/°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
Passive electronic component for current limiting and voltage division in circuits
Mechanical substrate for mounting and thermally managing individual LED semiconductor dies
A power semiconductor device used for high-power switching in plasma power supplies
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Ceramic substrates offer high thermal conductivity, excellent electrical insulation, and stability at high temperatures, making them ideal for dissipating heat and maintaining precision in SMD resistors during reflow soldering and operation.
Alumina (Al2O3) is most common due to its balance of performance and cost, while aluminum nitride (AlN) is used for high-power applications requiring better thermal conductivity.
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