INDUSTRY COMPONENT

Contact Pin Array

A high-density array of spring-loaded contact pins for reliable electrical connections in server backplane assemblies.

View Specifications

Component Specifications

Definition
A contact pin array is a precision-engineered component consisting of multiple spring-loaded conductive pins arranged in a grid pattern, designed to establish and maintain electrical connections between printed circuit boards (PCBs) in computer server backplane connector assemblies. It ensures signal integrity, power distribution, and mechanical stability in high-performance computing environments.
Working Principle
The contact pin array operates on the principle of spring-loaded compression, where each pin maintains consistent electrical contact through mechanical force. When mated with a corresponding receptacle, the pins compress slightly, creating a reliable connection that accommodates thermal expansion, vibration, and manufacturing tolerances while minimizing insertion force.
Materials
Phosphor bronze or beryllium copper pins with gold or tin plating; insulator housing made of high-temperature thermoplastics like PBT, LCP, or PPS; nickel underplating for corrosion resistance.
Technical Parameters
  • Pitch 0.8mm to 2.54mm
  • Pin Count 50-500 pins
  • Current Rating 1-3A per pin
  • Voltage Rating 50-250V AC/DC
  • Insertion Force 0.5-2.0N per pin
  • Insertion Cycles ≥500 cycles
  • Contact Resistance <20mΩ
  • Insulation Resistance >1000MΩ
  • Operating Temperature -55°C to +125°C
Standards
IEC 60512, EIA-364, MIL-STD-202

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Contact Pin Array.

contact pin array server backplane connector spring-loaded pins high-density connector PCB interconnect electrical contact assembly Contact Pin Array in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Computer Server Backplane Connector Assembly

High-density interconnect assembly for server motherboard-to-peripheral communication

View Product Details

Engineering Analysis

Risks & Mitigation
  • Pin misalignment during assembly
  • Contact corrosion in humid environments
  • Fatigue failure of spring mechanisms
  • Signal crosstalk at high frequencies
FMEA Triads
Trigger: Insufficient plating thickness
Failure: Increased contact resistance leading to overheating
Mitigation: Implement strict quality control for plating processes and use accelerated life testing.
Trigger: Housing material degradation at high temperatures
Failure: Loss of pin alignment and insulation breakdown
Mitigation: Select high-temperature thermoplastics and validate material performance through thermal cycling tests.

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.05mm pin position tolerance, ±0.1mm coplanarity
Test Method
Electrical continuity testing, insertion/extraction force measurement, environmental stress screening (ESS), and high-frequency signal integrity analysis

Procurement Evaluation Criteria

Not customer reviews or live demand data. These dimensions support RFQ preparation and supplier evaluation.

Technical documentation
4/5
Manufacturing capability
4/5
Inspection readiness
5/5
Supplier transparency
3/5

These scores are example evaluation dimensions, not real customer ratings, country-specific buyer feedback, or live inquiry activity.

Related Components

Memory Module
Memory module for Industrial IoT Gateway data storage and processing
Storage Module
Industrial-grade storage module for data logging and firmware in IoT gateways
Ethernet Controller
Industrial Ethernet controller for real-time data transmission in Industrial IoT Gateways.
Serial Interface
Serial interface for industrial data transmission between IoT gateways and legacy equipment using RS-232/422/485 protocols.

Frequently Asked Questions

What is the primary function of a contact pin array in a server backplane?

It provides multiple electrical pathways for power and signal transmission between PCBs, ensuring reliable connectivity in high-speed data processing environments.

How does spring-loading improve contact pin array performance?

Spring-loading maintains consistent contact pressure, compensating for thermal expansion, vibration, and mating tolerances, which reduces signal loss and prevents intermittent connections.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

Data Basis

CNFX manufacturer profiles, technical classification, publicly available product information, and ongoing plausibility checks.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Request Manufacturing Insight for Contact Pin Array

Contact Pads/Shoes Contact Pin/Socket