INDUSTRY COMPONENT

Contact Pin Array

A high-density array of spring-loaded contact pins for reliable electrical connections in server backplane assemblies.

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Component Specifications

Definition
A contact pin array is a precision-engineered component consisting of multiple spring-loaded conductive pins arranged in a grid pattern, designed to establish and maintain electrical connections between printed circuit boards (PCBs) in computer server backplane connector assemblies. It ensures signal integrity, power distribution, and mechanical stability in high-performance computing environments.
Working Principle
The contact pin array operates on the principle of spring-loaded compression, where each pin maintains consistent electrical contact through mechanical force. When mated with a corresponding receptacle, the pins compress slightly, creating a reliable connection that accommodates thermal expansion, vibration, and manufacturing tolerances while minimizing insertion force.
Materials
Phosphor bronze or beryllium copper pins with gold or tin plating; insulator housing made of high-temperature thermoplastics like PBT, LCP, or PPS; nickel underplating for corrosion resistance.
Technical Parameters
  • Pitch 0.8mm to 2.54mm
  • Pin Count 50-500 pins
  • Current Rating 1-3A per pin
  • Voltage Rating 50-250V AC/DC
  • Insertion Force 0.5-2.0N per pin
  • Insertion Cycles ≥500 cycles
  • Contact Resistance <20mΩ
  • Insulation Resistance >1000MΩ
  • Operating Temperature -55°C to +125°C
Standards
IEC 60512, EIA-364, MIL-STD-202

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Contact Pin Array.

contact pin array server backplane connector spring-loaded pins high-density connector PCB interconnect electrical contact assembly Contact Pin Array in Computer, Electronic and Optical Product Manufacturing

Parent Products

This component is used in the following industrial products

Computer Server Backplane Connector Assembly

High-density interconnect assembly for server motherboard-to-peripheral communication

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Engineering Analysis

Risks & Mitigation
  • Pin misalignment during assembly
  • Contact corrosion in humid environments
  • Fatigue failure of spring mechanisms
  • Signal crosstalk at high frequencies
FMEA Triads
Trigger: Insufficient plating thickness
Failure: Increased contact resistance leading to overheating
Mitigation: Implement strict quality control for plating processes and use accelerated life testing.
Trigger: Housing material degradation at high temperatures
Failure: Loss of pin alignment and insulation breakdown
Mitigation: Select high-temperature thermoplastics and validate material performance through thermal cycling tests.

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±0.05mm pin position tolerance, ±0.1mm coplanarity
Test Method
Electrical continuity testing, insertion/extraction force measurement, environmental stress screening (ESS), and high-frequency signal integrity analysis

Buyer Feedback

★★★★☆ 4.7 / 5.0 (34 reviews)

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Frequently Asked Questions

What is the primary function of a contact pin array in a server backplane?

It provides multiple electrical pathways for power and signal transmission between PCBs, ensuring reliable connectivity in high-speed data processing environments.

How does spring-loading improve contact pin array performance?

Spring-loading maintains consistent contact pressure, compensating for thermal expansion, vibration, and mating tolerances, which reduces signal loss and prevents intermittent connections.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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Connector Housing Contact Pins