Editorial Technical Reference

Computer Server Backplane Connector Assembly

This page explains how Computer Server Backplane Connector Assembly is classified within Manufacture of Computers and Peripheral Equipment. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

High-density interconnect assembly for server motherboard-to-peripheral communication

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Product Specifications

Technical details and manufacturing context for Computer Server Backplane Connector Assembly

Definition
A precision-engineered backplane connector assembly that provides the physical and electrical interface between a server motherboard and peripheral expansion cards, storage drives, or network modules. It enables high-speed data transfer, power delivery, and signal integrity across multiple connection points within server chassis. These components are critical for modular server architectures where hot-swappable functionality and reliable connectivity are essential for data center operations. The assembly typically consists of a housing made from high-temperature liquid crystal polymer (LCP) or similar thermoplastics, with contacts made from phosphor bronze alloy and plated with gold over nickel for corrosion resistance. The contact count ranges from 8 to 96 positions, with pitch spacing between 0.8 mm and 2.54 mm. Each contact can carry currents from 0.5 A to 3.0 A, and the assembly is rated for voltages from 30 V to 300 V. Insertion force per contact is between 0.5 N and 2.0 N, and the operating temperature range is -40°C to 85°C. Durability is specified as 200 to 500 mating cycles, suitable for hot-swap applications. Contact resistance is typically 10 to 50 mΩ, insulation resistance is at least 1000 MΩ at 500 V DC, and dielectric withstanding voltage is 500 to 1500 V AC for one minute without breakdown. Housing materials include LCP, PA46, and PBT, with a UL 94 V-0 flammability rating. The weight of the assembly varies from 5 g to 50 g depending on contact count and size. These parameters are reference ranges; actual values must be confirmed with the manufacturer for specific models and applications. The assembly is designed to maintain signal integrity through controlled impedance pathways and provides mechanical alignment for proper card insertion and retention. It is a component used in the manufacture of computers and peripheral equipment, and is not a standalone product. For procurement, verify model-specific specifications and compliance with relevant standards.
Working Principle
The assembly operates by aligning precision-machined contact pins in a specific pattern with corresponding sockets on a mating board or card. When mated, the pins establish electrical connections that enable signal and power transmission. The housing provides mechanical support and alignment, ensuring correct insertion and retention. Controlled impedance pathways within the assembly help maintain signal integrity for high-speed data transfer. The design allows for hot-swapping, where cards can be inserted or removed without powering down the system, due to the durability and contact design. The insertion force is optimized to balance secure connection with ease of mating.
Common Materials
Phosphor Bronze Alloy, High-Temperature Liquid Crystal Polymer (LCP), Nickel-Plated Steel
Technical Parameters
ParameterTypical rangeNotes & selection driver
Contact CountRequired8–96 positionsTotal number of electrical contact points
Pitch SpacingRequired0.8–2.54 mmDistance between adjacent contact centers
Current RatingRequired0.5–3.0 AMaximum current per contact
Voltage RatingRequired30–300 VMaximum working voltage
Insertion Force0.5–2.0 NForce required for mating
Operating TemperatureRequired-40–85 °CTemperature range for reliable operation
Durability200–500 cyclesHigher cycles for hot-swap applications
Contact Resistance10–50 mΩLower resistance for high-current paths
Insulation Resistance≥1000 MΩAt 500 V DC
Dielectric Withstanding Voltage500–1500 V ACFor 1 minute, no breakdown
Mating Cycles200–500 cyclesHigher for hot-swap
Housing MaterialLCP, PA46, PBTHigh-temperature thermoplasticUL 94 V-0
Contact PlatingAu 0.76–1.27 μmGold over nickel for corrosion resistance
Weight5–50 gDepends on contact count and size

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Contact Pin Array Part
    Provides electrical connection points
    Material: Phosphor Bronze with Gold Plating
  • Housing Body Part
    Structural support and alignment
    Material: High-Temperature LCP
  • Retention Clip Part
    Secures connector to PCB
    Material: Nickel-Plated Steel
  • EMI Shield Optional Part
    Electromagnetic interference protection
    Material: Zinc Alloy

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Computer Server Backplane Connector Assembly.

server backplane interconnect high-density server connector motherboard expansion connector

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (electrical connector, not fluid handling)
other spec: Current rating: 1A per contact, Voltage rating: 50V AC/DC, Contact resistance: <20mΩ, Insulation resistance: >1000MΩ
temperature: -40°C to +105°C
Media Compatibility
✓ Server-grade PCB materials (FR-4, Rogers) ✓ Copper alloy contacts with gold plating ✓ Standard server cooling air environments
Unsuitable: High-vibration industrial environments without additional mechanical support
Sizing Data Required
  • Number of required signal/power contacts
  • Required data transfer rate (Gbps per lane)
  • Physical space constraints and connector footprint

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Contact fretting corrosion
Cause: Micro-motion from thermal cycling or vibration causes wear on connector pins, leading to oxide buildup and increased electrical resistance.
Intermittent connection failure
Cause: Improper seating during assembly, thermal expansion mismatch, or mechanical stress causing pin misalignment and signal disruption.
Maintenance Indicators
  • Visible discoloration, oxidation, or burn marks on connector pins during inspection
  • Intermittent system errors, data corruption, or unexpected reboots correlated with vibration or temperature changes
Engineering Tips
  • Implement periodic infrared thermography scans to detect abnormal heat patterns at connector junctions indicating high resistance
  • Use torque-controlled installation tools and alignment guides during assembly/replacement to ensure proper seating and prevent mechanical stress

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI/EIA-364-E Electrical Connector Test Procedures DIN 41612 Connectors for Printed Boards

Quoted from the published standard.

Manufacturing Precision
  • Contact Pitch: +/-0.05mm
  • Insertion Force: +/-10% of specified value
Quality Inspection
  • Contact Resistance Test
  • Dimensional Verification via CMM

Manufacturers of Computer Server Backplane Connector Assembly

Manufacturer profiles associated with Computer Server Backplane Connector Assembly.

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Frequently Asked Questions

What is the typical contact count range for this backplane connector assembly?

The contact count ranges from 8 to 96 positions, depending on the specific model and application requirements.

What materials are used in the construction of this connector assembly?

The housing is typically made from high-temperature liquid crystal polymer (LCP) or similar thermoplastics, and the contacts are made from phosphor bronze alloy with gold-over-nickel plating for corrosion resistance.

Can this connector support hot-swapping of peripheral cards?

Yes, the assembly is designed for hot-swap applications, with a durability rating of 200 to 500 mating cycles, which allows for repeated insertion and removal without powering down the system.

What are the electrical ratings for this connector?

Each contact can carry currents from 0.5 A to 3.0 A, and the assembly is rated for voltages from 30 V to 300 V. Contact resistance is typically 10 to 50 mΩ, and insulation resistance is at least 1000 MΩ at 500 V DC.
Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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