Motherboard Fixture Tray: Max Load Capacity 5 kg, Weight 2.3 kg

Component Specifications

Definition

The Motherboard Fixture Tray is a specialized component within Thermal Chamber Assembly systems, engineered to provide stable, repeatable positioning of printed circuit boards (PCBs) during environmental stress testing. It ensures consistent thermal contact, prevents vibration-induced damage, and maintains electrical isolation while accommodating various motherboard form factors through adjustable mounting points.

Working Principle

Utilizes mechanical clamping and thermal interface materials to secure motherboards while allowing uniform heat transfer during thermal cycling tests. The tray maintains dimensional stability across temperature extremes (-40°C to +150°C) and provides electrical insulation to prevent short circuits during testing procedures.

Materials

6061-T6 aluminum alloy (primary structure), PEEK (polyether ether ketone) insulating components, stainless steel fasteners (A2-70 grade), silicone thermal pads (3-5 W/m·K conductivity)

Technical Parameters

Parameter	Typical range	Notes & selection driver
Weight	2.3 kg
Surface Flatness	0.05 mm/m²
Max Load Capacity	5 kg
Temperature Range	-40°C to +150°C
Dimensional Tolerance	±0.1 mm
Electrical Resistance	>10^12 Ω
Compatible Form Factors	ATX, microATX, mini-ITX

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IPC-A-610, MIL-STD-810

Parent Products

This component is used in the following industrial products

Thermal Chamber Assembly

A controlled-environment enclosure designed to subject computer motherboards to precise temperature cycling during burn-in testing.

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Engineering Analysis

Risks & Mitigation

Thermal expansion mismatch causing board warpage
Insufficient clamping force during vibration
Electrostatic discharge through fixture
Material degradation at temperature extremes

FMEA Triads

Trigger: Incorrect torque application on mounting screws
Failure: Insufficient thermal contact leading to inaccurate temperature readings
Mitigation: Implement calibrated torque drivers and regular torque verification procedures

Trigger: Thermal pad compression set over time
Failure: Reduced thermal transfer efficiency and potential board movement
Mitigation: Establish preventive maintenance schedule for pad replacement every 500 cycles

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

Positional accuracy ±0.15mm, flatness 0.1mm across entire surface

Test Method

Coordinate measuring machine (CMM) verification per ISO 10360, thermal cycling validation per IEC 60068-2-14

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

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Manufacturers of Motherboard Fixture Tray

Manufacturer profiles associated with Motherboard Fixture Tray.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What types of thermal tests is this fixture tray designed for?

This tray is optimized for thermal cycling tests, thermal shock tests, and high/low temperature storage tests according to industry standards like JEDEC and MIL-STD-883.

How does the tray prevent damage to sensitive motherboard components?

It uses PEEK insulating posts and silicone pads to create non-conductive mounting points, while precision machining ensures even pressure distribution without component stress.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Motherboard Fixture Tray