Silk Screen Layer: Thickness 15-25 μm

Component Specifications

Definition

The silk screen layer, also known as the legend or nomenclature layer, is a printed epoxy-based ink layer applied to the surface of Metal Core PCBs (MCPCBs) that displays component outlines, reference designators, polarity markings, logos, and other assembly information. It serves as a visual guide during manual and automated assembly processes, enhancing traceability and reducing assembly errors in high-power electronic applications.

Working Principle

The silk screen layer is applied using screen printing technology where ink is forced through a fine mesh screen onto the PCB surface. After printing, the ink is cured through thermal or UV processes to create a durable, non-conductive marking layer that withstands soldering temperatures and environmental conditions.

Materials

Epoxy-based ink with thermal conductivity additives, typically white or black in color, with operating temperature range of -40°C to 150°C, RoHS compliant, halogen-free formulations available.

Technical Parameters

Parameter	Typical range	Notes & selection driver
Adhesion	≥3B per ASTM D3359
Thickness	15-25 μm
Resolution	0.15 mm minimum line width
Dielectric Strength	≥15 kV/mm
Thermal Conductivity	0.2-0.5 W/m·K

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IPC-4781, IPC-4552, ISO 9001, IEC 61249-2-21

Parent Products

This component is used in the following industrial products

Metal Core PCB

A printed circuit board with a metal core substrate for enhanced thermal management.

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Engineering Analysis

Risks & Mitigation

Ink smearing during assembly
Poor adhesion to metal surfaces
Legibility issues with fine pitch components
Thermal expansion mismatch
Chemical incompatibility with cleaning solvents

FMEA Triads

Trigger: Insufficient ink curing
Failure: Ink smearing during soldering process
Mitigation: Implement proper curing protocols with temperature monitoring and UV intensity verification

Trigger: Surface contamination before printing
Failure: Poor ink adhesion leading to flaking
Mitigation: Establish pre-printing cleaning procedures with isopropyl alcohol and surface energy testing

Industrial Ecosystem

Compatible With

Typical Suppliers & Equivalents

Compliance & Inspection

Tolerance

±0.1 mm positional accuracy, ±5 μm thickness variation

Test Method

Visual inspection per IPC-A-610, adhesion testing per ASTM D3359, thermal cycling per IPC-TM-650 2.6.7

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Silk Screen Layer

Manufacturer profiles associated with Silk Screen Layer.

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Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review

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Frequently Asked Questions

What is the purpose of silk screen layer on Metal Core PCBs?

The silk screen layer provides visual identification of components, polarity markings, reference designators, and assembly instructions to facilitate correct component placement and orientation during PCB assembly, particularly important for high-power applications where thermal management is critical.

Can silk screen withstand high temperatures in Metal Core PCB applications?

Yes, specialized epoxy-based inks with thermal conductivity additives are used for MCPCB silk screen layers, designed to withstand soldering temperatures up to 260°C and continuous operating temperatures up to 150°C without degradation or discoloration.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Silk Screen Layer