Editorial Technical Reference

Buffer/Driver

This page explains how Buffer/Driver is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

An electronic component within a clock circuit that amplifies and stabilizes timing signals.

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Product Specifications

Technical details and manufacturing context for Buffer/Driver

Definition
A buffer/driver is a critical component in clock circuits that receives a timing signal, amplifies it to ensure sufficient drive strength, and provides signal conditioning to maintain signal integrity while distributing the clock signal to multiple loads within the system. This component is used in computer, electronic, and optical product manufacturing, where it serves as a part-level building block in clock distribution networks. The buffer/driver typically operates with a supply voltage in the range of 1.65–5.5 V for LVCMOS buffers, and it can source or sink up to ±24 mA of output current. Propagation delay is typically 1.5–4.5 ns at a 50 pF load and 1.8 V supply, with output skew between any two outputs of ≤0.5 ns. Input capacitance is 2–5 pF per input pin. The device is designed for industrial-grade operation over a temperature range of -40 to 85 °C. It has an ESD tolerance of ±2000 V (HBM model) per IEC 61000-4-2. The package type is SOT-23-5 (JEDEC MO-178), with a typical weight of 0.01–0.02 g. Materials used include silicon, copper, and plastic. As a neutral directory, we do not manufacture or sell this product; all listed values are reference ranges that must be confirmed with the legal manufacturer or supplier for the specific model and application. Verification questions should include checking the exact supply voltage range, output current capability, propagation delay, output skew, input capacitance, operating temperature, ESD tolerance, and package dimensions against the manufacturer's datasheet. Maintenance signals may include excessive output skew or propagation delay, which could indicate degradation. Failure boundaries are defined by the absolute maximum ratings, which are not listed here and must be obtained from the manufacturer.
Working Principle
The buffer/driver operates by receiving a low-power clock input signal, using internal amplification stages (typically CMOS or TTL logic) to increase current drive capability, and outputting a clean, robust clock signal with proper voltage levels and timing characteristics to drive downstream components. The input signal is buffered to isolate the source from the load, preventing loading effects. The amplification stages provide the necessary drive strength to fan out to multiple loads while maintaining signal integrity. The output is conditioned to ensure fast edges and minimal skew between outputs.
Common Materials
Silicon, Copper, Plastic
Technical Parameters
ParameterTypical rangeNotes & selection driver
Supply Voltage1.65–5.5 VOperating range for typical LVCMOS buffers
Output Current±24 mAMaximum sink/source capability
Propagation Delay1.5–4.5 nsAt 50 pF load, 1.8 V supply
Output Skew≤0.5 nsBetween any two outputs
Input Capacitance2–5 pFPer input pin
Operating Temperature-40–85 °CIndustrial grade
ESD Tolerance±2000 VHBM modelIEC 61000-4-2
Package TypeSOT-23-55-pin small outlineJEDEC MO-178
Weight0.01–0.02 gTypical for SOT-23-5

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Input Stage
    Receives and conditions the incoming clock signal
    Material: Silicon
  • Amplification Stage
    Amplifies the signal to provide sufficient drive strength
    Material: Silicon
  • Output Stage Part
    Delivers the amplified clock signal to downstream components
    Material: Copper
  • Package Part
    Protects the semiconductor die and provides electrical connections
    Material: Plastic

Application & selection

Application Fit & Sizing Matrix

Operational Limits
voltage: 1.2V to 3.6V
frequency: DC to 2.5GHz
temperature: -40°C to +125°C
output current: ±24mA
Media Compatibility
✓ Low-voltage CMOS circuits ✓ High-speed clock distribution networks ✓ Precision timing systems
Unsuitable: High-voltage power switching environments (>5V)
Sizing Data Required
  • Input clock frequency (Hz)
  • Output load capacitance (pF)
  • Required signal integrity (jitter in ps)

Risk, maintenance & compliance

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Hydraulic fluid degradation
Cause: Contamination from particulates, moisture ingress, or thermal breakdown exceeding fluid specifications, leading to loss of damping efficiency and increased wear.
Seal failure and leakage
Cause: Wear from misalignment, excessive pressure spikes, or chemical incompatibility with hydraulic fluid, resulting in fluid loss and reduced buffering capacity.
Maintenance Indicators
  • Audible knocking or hammering noises during operation, indicating insufficient damping and potential internal component impact.
  • Visible hydraulic fluid leaks around seals or connections, suggesting seal degradation or pressure-related failures.
Engineering Tips
  • Implement regular fluid analysis and filtration to maintain fluid cleanliness within ISO 4406 class targets, preventing abrasive wear and preserving viscosity.
  • Ensure proper alignment during installation and use pressure-limiting devices to avoid overpressure conditions that accelerate seal and component fatigue.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI B11.19 - Performance criteria for safeguarding CE Marking - EU Machinery Directive 2006/42/EC

Quoted from the published standard.

Manufacturing Precision
  • Bore diameter: +/-0.01mm
  • Surface flatness: 0.05mm per 100mm
Quality Inspection
  • Dimensional verification with CMM
  • Hardness testing (Rockwell C scale)
Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

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Manufacturers of Buffer/Driver

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

ETEK Microelectronics
Jiangsu, CN
ISO 26262
Also makes: Power Management, Voltage Monitor, Smart Meter and 3 more
Listed on the company's own website · profile compiled by CNFX from public sources
Listed there as: “Buffer, Driver and Transceiver”
View source page ↗ etekmicro.com · recorded 2026-08-22
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Frequently Asked Questions

What is the typical supply voltage range for this buffer/driver?

The typical supply voltage range for LVCMOS buffers is 1.65–5.5 V. However, you must verify the exact range for the specific model with the manufacturer's datasheet.

What is the output current capability?

The maximum sink/source capability is ±24 mA. This is a reference value; confirm the actual capability for your application with the manufacturer.

What is the propagation delay and output skew?

Propagation delay is typically 1.5–4.5 ns at 50 pF load and 1.8 V supply. Output skew between any two outputs is ≤0.5 ns. These values should be verified for the specific model.

What package is available and what is the operating temperature range?

The package type is SOT-23-5 (JEDEC MO-178). The operating temperature range is -40 to 85 °C (industrial grade). Always check the manufacturer's datasheet for exact specifications.

Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Related equipment

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Clock Circuit
View system integration details
Interface Circuits
View system integration details

Industrial Ecosystem & Supply Chain Structure

Downstream Applications

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Compiled and source-reviewed by the CNFX editorial team. Each manufacturer above links to the page on that company's own website where the product is listed, with the date we checked it. How we source and review · Page last updated 13 October 2026

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