Editorial Technical Reference

Clock and Data Recovery (CDR) Circuit

This page explains how Clock and Data Recovery (CDR) Circuit is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A circuit that extracts timing information from a data stream to synchronize receiver operations.

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Product Specifications

Technical details and manufacturing context for Clock and Data Recovery (CDR) Circuit

Definition
A Clock and Data Recovery (CDR) circuit is a component used in high-speed serial communication systems, particularly within Serializer/Deserializer (SerDes) architectures. Its primary function is to recover the clock signal embedded in an incoming serial data stream, enabling accurate sampling and retiming of the data at the receiver end. The CDR circuit analyzes transitions in the incoming data to generate a local clock that is phase-locked to the data's timing, typically using a phase-locked loop (PLL) or delay-locked loop (DLL) architecture. It adjusts the phase and frequency of a voltage-controlled oscillator (VCO) to match the incoming data rate, allowing for precise data sampling at the optimal point in the data eye. This component is essential for maintaining signal integrity in high-speed links, supporting data rates from 1 to 28 Gbps, and is commonly used in applications such as 10GbE and 25GbE Ethernet. The CDR operates on a single supply voltage ranging from 1.8V to 3.3V, with power consumption between 50 and 200 mW depending on data rate and output load. It features jitter tolerance of 0.6 to 1.0 UI, meeting or exceeding IEEE 802.3 requirements, and a lock time of 1 to 10 ms for fast acquisition in burst mode. The device is rated for industrial temperature ranges from -40°C to 85°C, with input sensitivity of 50 to 200 mV peak-to-peak differential and adjustable output swing of 400 to 800 mV differential. It is available in a QFN-32 package (5x5 mm, 0.5 mm pitch) and has an ESD rating of 2 to 4 kV (HBM model) per IEC 61000-4-2. The CDR is fabricated on silicon. For specific applications, it is crucial to verify model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The CDR circuit operates by monitoring transitions in the incoming data stream. It uses a phase-locked loop (PLL) or delay-locked loop (DLL) to generate a local clock signal. The phase and frequency of a voltage-controlled oscillator (VCO) are adjusted to match the incoming data rate, ensuring the clock is aligned with the data transitions. This allows the receiver to sample the data at the optimal point in the data eye, minimizing bit errors. The circuit continuously tracks the incoming signal to maintain synchronization.
Common Materials
Silicon
Technical Parameters
ParameterTypical rangeNotes & selection driver
Data Rate1–28 GbpsSupports common standards like 10GbE and 25GbE
Supply Voltage1.8–3.3 VSingle supply, tolerant to 5V for I/O
Power Consumption50–200 mWDepends on data rate and output load
Jitter Tolerance0.6–1.0 UIMeets or exceeds IEEE 802.3 requirements
Lock Time1–10 msFast acquisition for burst mode
Operating Temperature-40–85 °CIndustrial grade
Input Sensitivity50–200 mVPeak-to-peak differential
Output Swing400–800 mVDifferential, adjustable
Package TypeQFN-325x5 mm, 0.5 mm pitch
ESD Rating2–4 kVHBM modelIEC 61000-4-2

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Phase Detector
    Compares the phase of the incoming data with the recovered clock to generate an error signal.
    Material: Silicon
  • Voltage-Controlled Oscillator (VCO)
    Generates the local clock signal whose frequency is controlled by the phase detector's error signal.
    Material: Silicon
  • Loop Filter
    Filters the error signal from the phase detector to provide stable control voltage to the VCO.
    Material: Silicon

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (solid-state electronic component)
other spec: Data rate range: 1 Mbps to 28 Gbps, Jitter tolerance: <0.15 UI, Power supply: 1.8V to 3.3V
temperature: -40°C to +85°C (industrial grade), -40°C to +125°C (extended)
Media Compatibility
✓ Copper-based PCB traces ✓ Optical fiber data streams ✓ Backplane serial communication systems
Unsuitable: High electromagnetic interference (EMI) environments without proper shielding
Sizing Data Required
  • Data rate (bps)
  • Jitter specification (UI or ps)
  • Reference clock stability (ppm)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Phase Lock Loop (PLL) Jitter Accumulation
Cause: Voltage regulator noise, temperature-induced component drift, or aging capacitors degrading timing stability
Signal Integrity Degradation
Cause: PCB trace impedance mismatch, electromagnetic interference (EMI) from nearby circuits, or connector corrosion increasing bit error rates
Maintenance Indicators
  • Intermittent data synchronization errors or increased bit error rates in system logs
  • Abnormal thermal signature on the CDR IC or voltage regulator during infrared inspection
Engineering Tips
  • Implement periodic calibration using a precision reference clock to compensate for timing drift and component aging
  • Enhance EMI shielding and maintain clean, stable power supply with dedicated filtering to reduce noise-induced jitter

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
CE marking - EMC Directive 2014/30/EU

Quoted from the published standard.

Manufacturing Precision
  • Jitter tolerance: +/- 100 ps
  • Frequency accuracy: +/- 50 ppm
Quality Inspection
  • Bit Error Rate Test (BERT)
  • Eye diagram analysis

Manufacturers of Clock and Data Recovery (CDR) Circuit

Manufacturer profiles associated with Clock and Data Recovery (CDR) Circuit.

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Frequently Asked Questions

What is the typical data rate range for this CDR circuit?

The CDR supports data rates from 1 to 28 Gbps, covering common standards like 10GbE and 25GbE. However, the actual supported range may vary by model, so it is essential to check the specific part's datasheet.

What supply voltage does the CDR require?

The CDR operates on a single supply voltage between 1.8V and 3.3V, with I/O tolerant to 5V. Always confirm the exact voltage requirements for your specific model.

What is the jitter tolerance of this CDR?

The jitter tolerance is 0.6 to 1.0 UI, which meets or exceeds IEEE 802.3 requirements. This indicates the circuit's ability to handle input jitter without errors, but actual performance should be verified for your application.

What package options are available?

The CDR is available in a QFN-32 package with dimensions 5x5 mm and 0.5 mm pitch. Other package options may exist for different models, so consult the manufacturer's documentation.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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