Clock Distribution Buffer

Product Specifications

Technical details and manufacturing context for Clock Distribution Buffer

Definition

The Clock Distribution Buffer is a critical sub-component of a Master Clock Generator system. Its primary function is to take the high-precision master clock signal generated by the oscillator or synthesizer core, amplify it to appropriate voltage levels, and then fan it out to multiple output channels. It ensures signal integrity by providing impedance matching, reducing reflections, and isolating the sensitive master clock source from the varying loads of downstream circuits (e.g., processors, FPGAs, ADCs, DACs). This precise distribution is fundamental to maintaining synchronous operation across all subsystems in complex electronic equipment.

Typical parameters include a supply voltage range of 2.375–3.465 V (JEDEC JESD8-5), an output frequency range of 1–200 MHz, output skew of ≤50 ps between any two outputs, and additive phase jitter of ≤0.2 ps RMS (12 kHz to 20 MHz integration band). Input and output logic levels are LVCMOS/LVTTL (JEDEC JESD8-5). The device operates over -40 to 85 °C (industrial grade) and can be stored from -55 to 125 °C (IEC 60068-2-14). ESD protection (HBM) is ≥2000 V (JEDEC JESD22-A114). The package is a QFN-16 (JEDEC MO-220) with a 3×3 mm footprint and typical weight of 0.05–0.08 g.

Materials include a silicon semiconductor substrate, copper interconnects, and a ceramic or plastic package. The buffer is designed for use in computer, electronic, and optical product manufacturing. It is a component-level part, not a standalone system. Always verify model-specific values and standards with the legal manufacturer or supplier before procurement or integration.

Working Principle

The buffer typically employs high-speed, low-skew amplifier circuits (often based on differential signaling like LVDS, CML, or HCSL). It receives the master clock input, conditions it (e.g., converts single-ended to differential, adjusts voltage levels), and then replicates it through multiple, identical output driver stages. Internal design focuses on minimizing propagation delay differences (skew) between outputs and adding minimal timing uncertainty (jitter). Advanced versions may include features like programmable output delays, frequency multiplication/division, or output enable/disable controls.

Common Materials

Silicon (Semiconductor substrate), Copper (Interconnects), Ceramic or Plastic (Package)

Technical Parameters

Parameter	Typical range	Notes & selection driver
Supply Voltage	2.375–3.465 V	Core logic supply; outside range may cause undefined behavior.JEDEC JESD8-5
Output Frequency Range	1–200 MHz	Maximum frequency depends on load capacitance.
Output Skew	≤50 ps	Between any two outputs at same supply and temperature.
Additive Phase Jitter	≤0.2 ps RMS	12 kHz to 20 MHz integration band.
Input Logic Level	LVCMOS/LVTTL	Compatible with standard CMOS/TTL drivers.JEDEC JESD8-5
Output Logic Level	LVCMOS/LVTTL	Drives standard CMOS/TTL loads.JEDEC JESD8-5
Operating Temperature Range	-40–85 °C	Industrial grade; extended range available.IEC 60068-2-14
Storage Temperature Range	-55–125 °C	Non-operating condition.IEC 60068-2-14
ESD Protection (HBM)	≥2000 V	Human Body Model; machine model lower.JEDEC JESD22-A114
Package Type	QFN-16	Exposed pad for thermal dissipation.JEDEC MO-220
Package Footprint	3×3 mm	QFN-16 package body size.JEDEC MO-220
Weight	0.05–0.08 g	Typical for QFN-16 package.

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Input Buffer/Receiver Part
Receives and conditions the incoming master clock signal, providing impedance matching and level translation if necessary.

Material: Silicon (Integrated Circuit)
Clock Distribution Tree Part
Internal network (often a balanced H-tree or similar structure) that routes the clock signal from the input to each output driver with minimal path length variation.

Material: Copper (On-chip interconnects)
Output Driver
Amplifies the clock signal to the required voltage and current levels for the specified output logic standard and drives the external load.

Material: Silicon (Output transistors)
Power Supply Decoupling Capacitors Part
Integrated or external capacitors that filter power supply noise to minimize jitter generation within the buffer.

Material: Silicon Oxide / Tantalum / Ceramic

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Master Clock Generator

View system integration details

Sync Logic Controller

View system integration details

Manufacturers of Clock Distribution Buffer

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Frequently Asked Questions

What is the primary function of a Clock Distribution Buffer?

It receives a master clock signal, conditions it (e.g., level shifting, single-ended to differential conversion), and distributes it to multiple outputs with minimal skew and jitter, ensuring synchronous operation across subsystems.

What are the typical electrical specifications?

Supply voltage is 2.375–3.465 V, output frequency range is 1–200 MHz, output skew is ≤50 ps, and additive phase jitter is ≤0.2 ps RMS. Input/output logic levels are LVCMOS/LVTTL. These are reference ranges; confirm with the manufacturer.

What package options are available?

The listed package is QFN-16 (JEDEC MO-220) with a 3×3 mm footprint. Weight is typically 0.05–0.08 g. Other packages may exist; verify with the supplier.

How should I verify that this component meets my application requirements?

Check the datasheet for exact values, especially output skew, jitter, and frequency range under your load conditions. Also confirm operating temperature range and ESD ratings. Always consult the manufacturer for model-specific data.

Data Basis

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Preliminary Technical Classification

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jitter:	< 100 fs RMS typical (specify max phase jitter)
voltage:	1.8V to 3.3V typical (specify supply voltage range)
frequency:	Up to 2.5 GHz (specify max clock frequency)
output skew:	< 50 ps typical (specify max allowable skew)
temperature:	-40°C to +85°C (industrial), -55°C to +125°C (military)

Product Specifications

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