Editorial Technical Reference

Communication Interface Board

This page explains how Communication Interface Board is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A printed circuit board that provides standardized physical and electrical interfaces for data exchange between an industrial system and external devices or networks.

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Product Specifications

Technical details and manufacturing context for Communication Interface Board

Definition
Within an industrial system, the Communication Interface Board serves as the dedicated hardware component responsible for establishing, maintaining, and managing communication channels. It translates internal system signals into standardized protocols (e.g., Ethernet, RS-232/485, PROFIBUS, CAN bus) and vice versa, enabling seamless data transfer for control, monitoring, and diagnostics with PLCs, HMIs, sensors, actuators, and supervisory systems. The board operates by receiving electrical signals from the industrial system's main controller via its internal bus connectors. Onboard integrated circuits (ICs), such as transceivers, protocol chips, and microcontrollers, process these signals. They convert logic levels, encode/decode data packets according to specific communication standards, and drive the physical interface connectors (ports, terminals). The board also typically includes signal conditioning components (like opto-isolators or filters) to protect against electrical noise and ensure reliable data transmission in harsh industrial environments. The board is designed for industrial environments, with an operating temperature range of -40 to 85 °C and storage from -55 to 125 °C, per IEC 60068-2-1/2. It supports selectable protocols (PROFINET, EtherNet/IP, Modbus TCP) via DIP switch, and offers 2 to 8 configurable ports with auto-negotiation data rates of 10/100/1000 Mbit/s. Isolation voltage between ports and logic is 1500 V AC per IEC 61010-1. Power consumption ranges from 5 to 15 W depending on active ports, with a supply voltage of 24 V DC ±10% (reverse polarity protected). The board is DIN rail mountable, with dimensions of 100 x 75 x 25 mm and weight varying from 150 to 250 g based on port count. Ingress protection is IP20, or IP65 with an optional enclosure, per IEC 60529. Relative humidity tolerance is 5–95% non-condensing per IEC 60068-2-78. MTBF is 100,000 hours at 40°C ambient per IEC 61709. Materials include FR-4 PCB substrate, copper traces, and electronic components. Always verify model-specific values and standards with the legal manufacturer or supplier.
Working Principle
The board receives electrical signals from the main controller via internal bus connectors. Onboard ICs (transceivers, protocol chips, microcontrollers) process these signals: they convert logic levels, encode/decode data packets according to the selected protocol, and drive the physical interface connectors. Signal conditioning components like opto-isolators or filters protect against electrical noise and ensure reliable transmission in harsh industrial environments. The board supports auto-negotiation for data rates and protocol selection via DIP switch.
Common Materials
FR-4 PCB Substrate, Copper Traces, Electronic Components (ICs, resistors, capacitors, connectors)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Supply Voltage24 ±10% V DCReverse polarity protected
Power Consumption5–15 WDepends on number of active ports
Operating Temperature-40–85 °CExtended range for industrial useIEC 60068-2-1/2
Storage Temperature-55–125 °CNon-operatingIEC 60068-2-1/2
Relative Humidity5–95 %Non-condensingIEC 60068-2-78
Ingress ProtectionIP20–IP65IP65 with optional enclosureIEC 60529
Communication ProtocolsPROFINET, EtherNet/IP, Modbus TCPSelectable via DIP switchIEC 61158
Number of Ports2–8Configurable
Data Rate10/100/1000 Mbit/sAuto-negotiationIEEE 802.3
Isolation Voltage1500 V ACBetween ports and logicIEC 61010-1
MTBF100000 hAt 40°C ambientIEC 61709
Dimensions (W x H x D)100 x 75 x 25 mmDIN rail mountable
Weight150–250 gDepends on port count

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Microcontroller/Protocol Processor
    Manages communication protocols, handles data packet processing, and controls interface operations.
    Material: Silicon IC
  • Transceiver ICs
    Converts logic-level signals from the processor to the voltage levels required by the physical communication standard (e.g., RS-485 differential signals).
    Material: Silicon IC
  • Connector Ports Part
    Provide physical connection points for communication cables (e.g., RJ45 for Ethernet, terminal blocks for serial).
    Material: Metal (contacts), Plastic (housing)
  • Isolation Components Optional Part
    Provide galvanic isolation (e.g., using optocouplers or isolation transformers) to protect the main system from electrical surges or ground loops on communication lines.
    Material: Optocoupler ICs or Transformers
  • Printed Circuit Board
    The board itself: substrate and traces carrying the bus signals between the ICs and the ports.
  • DIP Switch
    Sets the protocol and data rate by hand before power-up.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Communication Interface Board.

Comm Board Interface Card

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Smart Camera Module
View system integration details
Electronics/Controller Unit
View system integration details
Status Dashboard Interface
View system integration details

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (board-level component)
other spec: Humidity: 5% to 95% non-condensing, Vibration: 5g max, Shock: 50g max
temperature: -40°C to +85°C
Media Compatibility
✓ Industrial Ethernet networks (PROFINET, EtherNet/IP) ✓ RS-485/422 serial communication systems ✓ Modbus TCP/RTU protocol environments
Unsuitable: High-voltage arc flash zones or explosive atmospheres without proper enclosure
Sizing Data Required
  • Required communication protocols (e.g., Ethernet, serial, fieldbus)
  • Number of simultaneous connections/device count
  • Data throughput requirements (bandwidth/latency)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Corrosion-induced connection failure
Cause: Exposure to moisture, humidity, or corrosive atmospheres leading to oxidation of copper traces, solder joints, or connector pins, resulting in increased resistance, intermittent connections, or open circuits.
Thermal stress and solder joint fatigue
Cause: Cyclic thermal expansion and contraction due to power cycling or ambient temperature fluctuations, causing mechanical stress on solder joints and component leads, leading to cracks, delamination, or intermittent failures.
Maintenance Indicators
  • Intermittent or erratic communication errors, data corruption, or unexplained system resets that correlate with environmental factors like temperature changes or vibration.
  • Visible signs of board degradation such as discoloration (browning or darkening of PCB material), bulging or leaking capacitors, or corrosion (green/white deposits) on connectors or traces.
Engineering Tips
  • Implement conformal coating on the PCB to protect against moisture, dust, and chemical exposure, ensuring proper selection of coating material (e.g., acrylic, silicone, or urethane) compatible with the operating environment and rework requirements.
  • Optimize thermal management by ensuring adequate airflow around the board, using heat sinks or thermal pads for high-power components, and avoiding placement near heat sources to minimize thermal cycling stress and prolong component lifespan.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 61000-6-2 Electromagnetic Compatibility (EMC) CE Marking (EU Directive 2014/35/EU Low Voltage Directive)

Quoted from the published standard.

Manufacturing Precision
  • PCB Hole Diameter: +/-0.05mm
  • Component Placement Accuracy: +/-0.1mm
Quality Inspection
  • In-Circuit Test (ICT) for Electrical Continuity
  • Environmental Stress Screening (ESS) for Thermal and Vibration Reliability

Manufacturers of Communication Interface Board

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Shenzhen STHL Technology Co., Ltd.
Shenzhen, Guangdong, CN
Also makes: Heavy Copper PCB, Connector / Cable Assembly, PCB Assembly and 9 more
Listed on the company's own website · profile compiled by CNFX from public sources
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Frequently Asked Questions

What communication protocols does the board support?

The board supports PROFINET, EtherNet/IP, and Modbus TCP, selectable via a DIP switch. These protocols are per IEC 61158. Verify the exact protocol support for your model with the manufacturer.

What is the operating temperature range?

The operating temperature range is -40 to 85 °C, and storage temperature is -55 to 125 °C, per IEC 60068-2-1/2. Ensure your application environment stays within these limits.

How many ports are available?

The board offers 2 to 8 configurable ports, depending on the model. The number of ports affects power consumption and weight. Check the specific model's datasheet for exact port count.

What is the isolation voltage?

The isolation voltage between ports and logic is 1500 V AC, per IEC 61010-1. This provides electrical isolation for safety and noise immunity. Confirm the isolation rating for your application.
Data basis: editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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