Contact Probe Array for Automated PCB Testing | Specifications & Applications

Product Specifications

Technical details and manufacturing context for Contact Probe Array

Definition

The Contact Probe Array is a critical component within an Electrical Test Fixture, consisting of multiple individual spring-loaded probes arranged in a specific pattern that matches the test points on the device under test (DUT). Its primary role is to provide reliable, repeatable, and low-resistance electrical connections between the test system's instrumentation (e.g., a bed-of-nails tester, flying probe, or in-circuit tester) and the DUT's pads, pins, or vias. This enables the execution of functional tests, continuity checks, in-circuit tests (ICT), and boundary-scan tests. The array's design is customized for each specific PCB or component layout to ensure accurate alignment and contact pressure.

Each probe in the array is a spring-loaded pogo pin. When the test fixture is actuated (e.g., a vacuum or pneumatic press lowers the fixture plate), the array is pressed onto the DUT. The probes compress, their internal springs ensuring consistent contact force. The probe tip (often a sharp or crowned point) makes physical and electrical contact with the test point, while the probe body connects to a wire or trace to the test system. This creates a temporary circuit path for applying test signals and measuring responses. After testing, the fixture retracts, and the springs return the probes to their extended position.

Typical specifications include a probe count of 16 to 512, pitch from 0.5 to 2.54 mm, probe diameter from 0.3 to 1.5 mm, contact resistance up to 50 mΩ, current rating from 1 to 5 A, operating temperature from -40 to 85 °C, probe travel from 1.5 to 6.0 mm, spring force from 0.5 to 2.0 N at 2/3 travel, insulation resistance of at least 1000 MΩ between adjacent probes at 100 V DC, and dielectric withstanding voltage of 500 V AC for 1 minute. Materials include beryllium copper (BeCu) for spring and body, tungsten carbide or hardened steel for tip, and gold or nickel plating. Housing is high-temperature thermoplastic (PPS) with UL 94 V-0 rating. Weight ranges from 0.5 to 5.0 kg, and IP rating is IP54 per IEC 60529. These values are reference ranges; verify model-specific parameters with the manufacturer.

Working Principle

Each probe in the array is a spring-loaded pogo pin. When the test fixture is actuated (e.g., a vacuum or pneumatic press lowers the fixture plate), the array is pressed onto the DUT. The probes compress, their internal springs ensuring consistent contact force. The probe tip (often a sharp or crowned point) makes physical and electrical contact with the test point, while the probe body connects to a wire or trace to the test system. This creates a temporary circuit path for applying test signals and measuring responses. After testing, the fixture retracts, and the springs return the probes to their extended position.

Common Materials

Beryllium Copper (BeCu) for spring and body, Tungsten Carbide or Hardened Steel for tip, Gold or Nickel plating for conductivity/corrosion resistance

Technical Parameters

Parameter	Typical range	Notes & selection driver
Number of Probes	16–512 pcs	Customizable based on test points
Probe Pitch	0.5–2.54 mm	Minimum pitch limited by probe diameter
Probe Diameter	0.3–1.5 mm	Affects contact resistance and current rating
Contact Resistance	≤50 mΩ	Measured at specified operating pressure
Current Rating	1–5 A	Per probe, continuous
Operating Temperature	-40–85 °C	Extended range available on request
Probe Travel	1.5–6.0 mm	Total spring deflection
Spring Force	0.5–2.0 N	At 2/3 travel
Insulation Resistance	≥1000 MΩ	Between adjacent probes at 100 V DC
Dielectric Withstanding Voltage	500 V AC	For 1 minute, between adjacent probes
Probe Material	BeCu	Beryllium copper, gold-plated tipASTM B196
Housing Material	PPS	High temperature thermoplasticUL 94 V-0
Weight	0.5–5.0 kg	Depends on size and probe count
IP Rating	IP54	Dust and splash resistantIEC 60529

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Probe Tip Part
Makes physical and electrical contact with the test point on the DUT. Designed to penetrate oxide layers and ensure low resistance.

Material: Tungsten Carbide, Hardened Steel, or specialty alloys
Probe Barrel (Body) Part
Houses the spring and provides the structural shell. Guides the plunger and often serves as one electrical terminal.

Material: Beryllium Copper, Brass, or Stainless Steel
Plunger Part
The internal moving part that carries the tip. Compresses the spring during contact and conducts current.

Material: Beryllium Copper or similar spring alloy
Spring Part
Provides the necessary contact force and allows for vertical compliance to accommodate DUT thickness variations and ensure uniform pressure.

Material: Beryllium Copper or Stainless Steel
Retention Mechanism (e.g., Clamp, Plate) Part
Secures the probes in their precise locations within the fixture plate, maintaining alignment and pitch.

Material: Acrylic, FR4, Aluminum, or Stainless Steel

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Electrical Test Fixture

View system integration details

Manufacturers of Contact Probe Array

Manufacturer profiles associated with Contact Probe Array.

Sourcing Contact Probe Array from China?

Tell us your specification and target quantity — we will match it against manufacturer records and come back with the factories that fit.

Request manufacturers We manufacture this

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Frequently Asked Questions

What is the typical number of probes in a contact probe array?

The number of probes is customizable based on the test points, typically ranging from 16 to 512 pieces. The exact count depends on the specific PCB or component layout and must be confirmed for each application.

What materials are used in the construction of contact probe arrays?

Common materials include beryllium copper (BeCu) for the spring and body, tungsten carbide or hardened steel for the tip, and gold or nickel plating for conductivity and corrosion resistance. The housing is typically made of high-temperature thermoplastic (PPS) with a UL 94 V-0 rating.

What is the maximum contact resistance specified for these probes?

The contact resistance is specified as ≤50 mΩ, measured at the specified operating pressure. This value is a reference range; actual performance should be verified with the manufacturer for the specific model.

What is the operating temperature range for contact probe arrays?

The standard operating temperature range is -40 to 85 °C. Extended ranges may be available on request, but this must be confirmed with the supplier.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Buyer enquiry

Request manufacturing insight for Contact Probe Array

Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.

Where it goes: Straight to the CNFX editorial desk, and to the manufacturer if this product is linked to a claimed profile. Nothing is broadcast to a supplier list.
Your details stay here: We do not sell or rent enquiry data, and we do not add you to a mailing list. Used only to answer this request.
No commission, no middleman: CNFX is a directory. We take no cut of any order and never negotiate on a supplier's behalf.
What we don't claim: A listing is not an endorsement. Qualify every supplier and verify every figure yourself before ordering.

pressure:	Max 50g per probe contact force
other spec:	Current rating: 1-3A per probe, Contact resistance: <50mΩ
temperature:	-40°C to +125°C

Contact Probe Array

Product Specifications

Applied To / Applications

Industrial Ecosystem & Supply Chain Structure

Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

Compliance & Manufacturing Standards