Based on aggregated insights from structured factory profiles within the CNFX directory, the standard Contact Probe Array used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Contact Probe Array is characterized by the integration of Probe Tip and Probe Barrel (Body). In industrial production environments, manufacturers listed on CNFX commonly emphasize Beryllium Copper (BeCu) for spring and body construction to support stable, high-cycle operation across diverse manufacturing scenarios.
A precisely arranged set of spring-loaded electrical probes used to establish temporary electrical connections with test points on electronic devices or printed circuit boards (PCBs) during automated testing.
Technical details and manufacturing context for Contact Probe Array
Commonly used trade names and technical identifiers for Contact Probe Array.
This component is essential for the following industrial systems and equipment:
| pressure: | Max 50g per probe contact force |
| other spec: | Current rating: 1-3A per probe, Contact resistance: <50mΩ |
| temperature: | -40°C to +125°C |
Manufacturer profiles with relevant production capability in China
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A contact probe array consists of five key components: plunger, probe barrel (body), probe tip, spring, and retention mechanism (clamp or plate). These work together to create temporary electrical connections during automated testing.
Beryllium copper (BeCu) is used because it offers excellent spring properties, high conductivity, and good corrosion resistance. This ensures consistent contact force and reliable electrical performance over thousands of test cycles.
Gold or nickel plating enhances conductivity and provides superior corrosion resistance. This maintains stable electrical connections, reduces contact resistance, and extends the probe array's lifespan in demanding testing environments.
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