This page explains how Contact Array is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A structured arrangement of electrical contact points within a test fixture interface.
Technical details and manufacturing context for Contact Array
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Number of Contacts | 100–1000 pcs | Customizable based on device under test (DUT) pin count. |
| Contact Pitch | 0.5–2.54 mm | Standard pitches; finer pitches require precision manufacturing. |
| Contact Resistance | ≤50 mΩ | Lower resistance ensures signal integrity. |
| Insulation Resistance | ≥1000 MΩ | At 500 V DC; ensures no leakage between contacts. |
| Dielectric Withstanding Voltage | 500–1000 V AC | For 1 minute; prevents arcing. |
| Current Rating | 1–5 A | Per contact; higher currents require larger contacts. |
| Operating Temperature | -40–85 °C | Extended range available on request. |
| Contact Material | BeCu | Beryllium copper; alternative: phosphor bronze.ASTM B194 |
| Plating | Au 0.76–1.27 μm | Gold over nickel; ensures low contact resistance.ASTM B488 |
| Spring Force | 0.5–1.5 N | Per contact; consistent force for reliable contact. |
| Mechanical Life | 100000–500000 cycles | Dependent on spring design and material. |
| Operating Pressure | 1.0–1.6 MPa |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | 0 to 50 psi |
| other spec: | Contact force: 10-200g per pin, Insertion cycles: 10,000+ |
| temperature: | -40°C to +125°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Contact Array.
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A contact array is used in test fixtures to establish reliable electrical connections between test equipment and a device under test (DUT). It enables simultaneous testing of multiple points or channels for signal transmission, power delivery, or measurement during testing procedures.
Common contact materials include beryllium copper (BeCu) per ASTM B194 and phosphor bronze as an alternative. Contacts are typically plated with gold over nickel, with gold thickness of 0.76 to 1.27 μm per ASTM B488, to ensure low contact resistance.
Typical specifications include contact resistance ≤50 mΩ, insulation resistance ≥1000 MΩ at 500 V DC, dielectric withstanding voltage 500–1000 V AC for 1 minute, and current rating 1–5 A per contact. These are reference ranges and must be verified for the specific model.
Selection depends on the DUT's pin count, pitch, current requirements, operating environment, and mechanical life expectations. Review parameters such as number of contacts, contact pitch, spring force, and operating temperature. Always confirm model-specific values with the legal manufacturer or supplier.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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