Editorial Technical Reference

Cooling Solution (Heatsink/Fan)

This page explains how Cooling Solution (Heatsink/Fan) is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

This cooling solution is a component-level thermal management assembly designed for Graphics Processing Units (GPUs).

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Cooling Solution (Heatsink/Fan)

Definition
This cooling solution is a component-level thermal management assembly designed for Graphics Processing Units (GPUs). It combines a heatsink and a fan to transfer and dissipate the thermal energy generated during GPU operation, preventing overheating and maintaining optimal performance. The heatsink, typically made of aluminum alloy or copper, absorbs heat from the GPU die through direct contact or a thermal interface material such as thermal paste. The fan then forces air across the heatsink fins to accelerate heat dissipation via convection. This product is used in computer, electronic, and optical product manufacturing, particularly in desktop PCs, workstations, and servers where GPUs are deployed. The cooling capacity must match the GPU's thermal design power (TDP), typically ranging from 150 to 300 watts. Airflow ranges from 30 to 80 cubic feet per minute (CFM), with higher values for server GPUs. Static pressure, needed for dense fin arrays, is between 2.0 and 6.0 mmH2O. Noise levels range from 20 to 45 dBA, with values below 30 dBA preferred for quiet PCs. Fan speed is PWM controlled, ranging from 800 to 3000 RPM. The bearing type is fluid dynamic bearing (FDB) for longevity. Thermal resistance is between 0.05 and 0.15 °C/W, with lower values indicating better performance. Operating temperature ranges from -20 to 70 °C. Input voltage is 12 V DC ±10%, and power consumption is 2 to 10 watts. Mean time between failures (MTBF) is 50,000 to 100,000 hours at 40 °C ambient. The assembly weighs 300 to 800 grams, and typical dimensions are 120x120x25 mm. These values are directory reference ranges; verify model-specific specifications with the manufacturer or supplier.
Working Principle
The heatsink absorbs heat from the GPU die through direct contact or a thermal interface material. The fan forces air across the heatsink fins, accelerating heat dissipation through convection. This process transfers thermal energy from the GPU to the surrounding environment, maintaining safe operating temperatures.
Common Materials
Aluminum alloy, Copper, Thermal paste
Technical Parameters
ParameterTypical rangeNotes & selection driver
Cooling Capacity150–300 WMust match GPU TDP
Airflow30–80 CFMHigher for server GPUs
Static Pressure2.0–6.0 mmH2ONeeded for dense fin arrays
Noise Level20–45 dBABelow 30 dBA for quiet PCs
Fan Speed800–3000 RPMPWM controlled
Bearing TypeFDBFDB for longevity
Thermal Resistance0.05–0.15 °C/WLower is better
Operating Temperature-20–70 °CAmbient range
Input Voltage12 ±10% V DCStandard GPU fan voltage
Power Consumption2–10 WFan power draw
MTBF50000–100000 hAt 40°C ambient
Weight300–800 gHeatsink and fan assembly
Dimensions (LxWxH)120x120x25 mmTypical fan size

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Heatsink Base Part
    Direct contact surface for heat absorption from GPU
    Material: Copper or aluminum
  • Heat Pipes Part
    Transfer heat from base to fins through phase change
    Material: Copper
  • Cooling Fins Part
    Increase surface area for heat dissipation
    Material: Aluminum alloy
  • Fan Assembly
    Generate airflow across heatsink fins
    Material: Plastic with ball bearings
  • Thermal Interface Material Optional
    Conducts heat from the GPU die into the heatsink base.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Cooling Solution (Heatsink/Fan).

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: 0-5 psi static pressure drop across heatsink, fan rated for 0-1 atm ambient
other spec: Airflow: 10-150 CFM typical, noise: 15-45 dBA, power: 5-48 VDC, 0.5-5 W
temperature: -40°C to +85°C (ambient), up to +125°C (component contact)
Media Compatibility
✓ Electronics enclosures (air cooling) ✓ GPU/CPU heat spreaders (direct contact) ✓ Server rack forced-air systems
Unsuitable: Submerged or high-humidity (>85% RH) environments without IP-rated protection
Sizing Data Required
  • GPU TDP (Thermal Design Power) in watts
  • Available space/clearance (LxWxH in mm)
  • Target component temperature delta (ΔT in °C)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Fan Bearing Failure
Cause: Lubricant degradation due to thermal cycling and dust accumulation, leading to increased friction and eventual seizure or excessive vibration.
Heatsink Thermal Interface Degradation
Cause: Thermal paste drying out or pump-out effect from thermal cycling, causing increased thermal resistance and reduced heat transfer efficiency.
Maintenance Indicators
  • Unusual grinding, rattling, or clicking noises from the fan indicating bearing wear or obstruction
  • Visible dust accumulation on heatsink fins exceeding 50% coverage or thermal throttling alerts from system monitoring
Engineering Tips
  • Implement regular compressed air cleaning cycles (quarterly) with anti-static precautions to prevent dust buildup while maintaining fan balance
  • Establish preventive thermal paste replacement schedule (every 2-3 years) using high-quality, pump-out resistant compounds with proper application techniques

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ANSI/ASHRAE 51-1999 - Laboratory Methods of Testing Fans for Rating DIN EN 60335-2-80 - Safety of Household and Similar Electrical Appliances

Quoted from the published standard.

Manufacturing Precision
  • Bore Diameter: +/-0.02mm
  • Flatness: 0.1mm per 100mm
Quality Inspection
  • Thermal Performance Test (Heat Dissipation Capacity)
  • Vibration Analysis (Fan Balance and Noise Level)

Manufacturers of Cooling Solution (Heatsink/Fan)

6 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

Jiangsu Guorui Hydraulic Machinery Co., Ltd.
Jiangsu, CN
Founded 1986340 plus staff120,000㎡
Listed on the company's own website · profile compiled by CNFX from public sources
Changzhou Fenfei Technology Co., Ltd.
Jiangsu, CN
Also makes: Temperature Control
Listed on the company's own website · profile compiled by CNFX from public sources
Chillerone
Shandong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
HACST
Shandong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Lori
Guangdong, CN
Listed on the company's own website · profile compiled by CNFX from public sources
Wuxi Guanyun Heat Exchanger Co., Ltd.
Jiangsu, CN
Also makes: Heat Exchanger
Listed on the company's own website · profile compiled by CNFX from public sources

Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

Technical documentation
Request current drawings, revision history, and a signed specification sheet.
Manufacturing capability
Verify equipment lists, process limits, capacity, and representative production evidence.
Inspection readiness
Confirm test methods, calibrated equipment, sampling plans, and traceable reports.
Supplier transparency
Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

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Frequently Asked Questions

What is the typical cooling capacity range for this GPU cooling solution?

The cooling capacity typically ranges from 150 to 300 watts, which must match the GPU's thermal design power (TDP). Always verify the specific cooling capacity required for your GPU model with the manufacturer.

What are the common airflow and static pressure values?

Airflow ranges from 30 to 80 CFM, with higher values for server GPUs. Static pressure ranges from 2.0 to 6.0 mmH2O, which is needed for dense fin arrays. Confirm these values for your specific application.

What is the noise level of this cooling solution?

Noise levels range from 20 to 45 dBA. For quiet PCs, values below 30 dBA are preferred. The actual noise level depends on fan speed and system configuration; verify with the supplier.

What is the expected lifespan (MTBF) of the fan?

The mean time between failures (MTBF) is 50,000 to 100,000 hours at 40°C ambient temperature. This is a reference range; actual lifespan may vary based on operating conditions and maintenance.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.
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