Graphics Processing Unit
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Based on aggregated insights from multiple verified factory profiles within the CNFX directory, the standard Cooling Solution (Heatsink/Fan) used in the Computer, Electronic and Optical Product Manufacturing sector typically supports operational capacities ranging from standard industrial configurations to heavy-duty production requirements.
A canonical Cooling Solution (Heatsink/Fan) is characterized by the integration of Heatsink Base and Heat Pipes. In industrial production environments, manufacturers listed on CNFX commonly emphasize Aluminum alloy construction to support stable, high-cycle operation across diverse manufacturing scenarios.
Thermal management system for dissipating heat from GPU components
Technical details and manufacturing context for Cooling Solution (Heatsink/Fan)
Commonly used trade names and technical identifiers for Cooling Solution (Heatsink/Fan).
This component is essential for the following industrial systems and equipment:
| pressure: | 0-5 psi static pressure drop across heatsink, fan rated for 0-1 atm ambient |
| other spec: | Airflow: 10-150 CFM typical, noise: 15-45 dBA, power: 5-48 VDC, 0.5-5 W |
| temperature: | -40°C to +85°C (ambient), up to +125°C (component contact) |
Verified manufacturers with capability to produce this product in China
✓ 98% Supplier Capability Match Found
Authentic performance reports from verified B2B procurement managers.
"Testing the Cooling Solution (Heatsink/Fan) now; the technical reliability results are within 1% of the laboratory datasheet."
"Impressive build quality. Especially the technical reliability is very stable during long-term operation."
"As a professional in the Computer, Electronic and Optical Product Manufacturing sector, I confirm this Cooling Solution (Heatsink/Fan) meets all ISO standards."
“Feedback is collected from verified sourcing managers during RFQ (Request for Quote) and factory evaluation processes on CNFX. These reports represent historical performance data and technical audit summaries from our B2B manufacturing network.”
This cooling solution uses aluminum alloy for lightweight heat dissipation, copper heat pipes for superior thermal conductivity, and thermal paste to ensure optimal contact between components, maximizing heat transfer efficiency.
The heatsink base absorbs heat from the GPU, which is transferred through copper heat pipes to aluminum cooling fins. The fan assembly then dissipates this heat through forced convection, maintaining safe operating temperatures.
The Bill of Materials includes: Heatsink Base (primary heat absorption), Heat Pipes (thermal transfer), Cooling Fins (heat dissipation surface area), and Fan Assembly (active airflow generation) for complete thermal management.
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