Die Attach Machine
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This page explains how Curing Station is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A specialized station within a die attach machine that applies controlled heat to cure adhesives or epoxies used in semiconductor die bonding.
Technical details and manufacturing context for Curing Station
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Curing Temperature Range | 150–250 °C | Typical for epoxy adhesives; higher temperatures may damage components. |
| Temperature Uniformity | ±3 °C | Across the heating plate; critical for consistent curing. |
| Curing Time Range | 10–120 s | Programmable per recipe; affects throughput. |
| Heating Rate | 5–20 °C/s | Rapid heating may cause thermal stress. |
| Cooling Rate | 2–10 °C/s | Controlled cooling prevents warpage. |
| Heating Power | 1.5–3.0 kW | Depends on plate size and thermal mass. |
| Supply Voltage | 220–240 V AC | Single phase; other voltages on request. |
| Supply Frequency | 50–60 Hz | Auto-switching or manual selectable. |
| Operating Pressure | 0.4–0.6 MPa | For pneumatic actuators; below 0.4 MPa may cause insufficient clamping. |
| Air Consumption | 50–150 L/min | At operating pressure; varies with cycle rate. |
| Overall Dimensions (W×D×H) | 600×800×1500 mm | Approximate; may vary by configuration. |
| Weight | 150–250 kg | Depends on options and materials. |
| Ingress Protection Rating | IP54–IP65 | Protection against dust and water jets.IEC 60529 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Curing Station.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric to 5 psi (for contact pressure) |
| other spec: | Heating ramp rate: 1-10°C/sec, Cooling capability: Active cooling to 50°C within 60 sec |
| temperature: | 50-250°C (typical), ±1°C control accuracy |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Curing Station.
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A practical evidence checklist for RFQ preparation and supplier evaluation.
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The typical curing temperature range is 150–250 °C, as listed in the reference parameters. However, the exact range depends on the adhesive or epoxy used and the specific model. Always verify with the manufacturer for your application.
Temperature uniformity is maintained within ±3 °C across the heating plate. This is achieved through multiple heating elements and temperature sensors that provide feedback to a PID controller, which adjusts power to minimize variations.
The heating power ranges from 1.5 to 3.0 kW, and the supply voltage is 220–240 V AC at 50–60 Hz. These are reference values; confirm the exact requirements with the manufacturer for the specific model.
Yes, the curing station is designed to handle various adhesives and epoxies. The curing time and temperature profile can be programmed per recipe, typically within the ranges of 10–120 seconds and 150–250 °C. However, the suitability for a specific adhesive must be verified with the manufacturer.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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