This page explains how Die Attach Machine is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A precision assembly machine used to attach semiconductor dies to substrates or leadframes using adhesive materials.
Technical details and manufacturing context for Die Attach Machine
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Placement AccuracyRequired | ±0.05 μm | Maximum deviation from target placement position |
| Throughput RateRequired | 3000–8000 UPH | Units per hour processing capacity |
| Die Size RangeRequired | 0.2×0.2–50×50 mm | Minimum to maximum die dimensions the machine can handle |
| Dispensing AccuracyRequired | ±0.02 mg | Precision of adhesive dispensing weight control |
| Curing Temperature Range | 80–200 °C | Temperature range for adhesive curing process |
| Substrate Size | 50×50–300×300 mm | Maximum substrate handling capability |
| Adhesive Viscosity Range | 1000–50000 mPa·s | Compatible with dispensing system |
| Operating Temperature | 15–35 °C | For stable machine performance |
| Operating Humidity | 30–70 %RH | Non-condensing |
| Power Supply | 220–240 V AC | Single phase, 50/60 Hz |
| Air Supply Pressure | 0.5–0.7 MPa | For pneumatic actuators |
| Machine Weight | 1500–2500 kg | Depending on configuration |
| Footprint (L×W×H) | 2000×1500×1800 mm | Approximate dimensions |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
| pressure: | 0.5-5.0 kgf (bonding force range) |
| other spec: | Placement accuracy: ±5-15 μm, Throughput: 5-20k UPH, Adhesive dispense volume: 0.1-10 mg |
| temperature: | 20-30°C (operating environment), 150-200°C (curing temperature range) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
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The placement accuracy is ±0.05 μm, as listed in the reference specifications. This value indicates the maximum deviation from the target placement position. Actual performance may vary depending on the specific model and setup; always confirm with the manufacturer.
The machine can handle die sizes ranging from 0.2×0.2 mm to 50×50 mm. This range covers a wide variety of semiconductor dies. For specific die size requirements, verify compatibility with the supplier.
The throughput rate is 3000–8000 units per hour (UPH), depending on the configuration and process parameters. This is a reference range; actual throughput may vary based on die size, adhesive type, and curing time.
The machine operates in a temperature range of 15–35 °C and humidity of 30–70% RH (non-condensing). It requires a power supply of 220–240 V AC, single phase, 50/60 Hz, and an air supply pressure of 0.5–0.7 MPa. Ensure these conditions are met for stable performance.
Commonly used trade names and technical identifiers for Die Attach Machine.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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