Die Attach Machine

Product Specifications

Technical details and manufacturing context for Die Attach Machine

Definition

A die attach machine is an automated precision assembly system used in semiconductor packaging to accurately place and bond semiconductor dies onto substrates, leadframes, or other packages. It applies controlled amounts of adhesive materials (epoxy, solder paste, or film) and precisely positions dies with micron-level accuracy before curing or reflowing to create permanent electrical and mechanical connections. The machine integrates dispensing, pick-and-place, vision alignment, and curing processes in a single platform. It handles a die size range from 0.2×0.2 mm to 50×50 mm and substrates up to 300×300 mm. Placement accuracy is ±0.05 mm, and throughput ranges from 3000 to 8000 units per hour. Dispensing accuracy is ±0.02 mg, and adhesive viscosity range is 1000–50000 mPa·s. Curing temperature range is 80–200 °C. The machine operates within 15–35 °C and 30–70% RH (non-condensing). Power supply is 220–240 V AC, single phase, 50/60 Hz. Air supply pressure is 0.5–0.7 MPa. Machine weight is 1500–2500 kg, and footprint is approximately 2000×1500×1800 mm. Constructed with stainless steel, aluminum alloy, ceramic components, and precision bearings. These specifications are reference values; verify model-specific details with the manufacturer.

Working Principle

The machine operates by first dispensing a precise amount of adhesive onto the substrate using a needle or jet dispenser. A pick-and-place mechanism with a vacuum collet then picks up a die from a wafer frame or waffle pack, aligns it using vision systems, and places it onto the adhesive-coated substrate. The adhesive is then cured through heat, UV light, or other methods to create a permanent bond. Advanced machines incorporate force sensors, multiple cameras, and closed-loop control systems to ensure placement accuracy and bond quality.

Common Materials

Stainless Steel, Aluminum Alloy, Ceramic Components, Precision Bearings

Technical Parameters

Parameter	Typical range	Notes & selection driver
Placement AccuracyRequired	±0.05 μm	Maximum deviation from target placement position
Throughput RateRequired	3000–8000 UPH	Units per hour processing capacity
Die Size RangeRequired	0.2×0.2–50×50 mm	Minimum to maximum die dimensions the machine can handle
Dispensing AccuracyRequired	±0.02 mg	Precision of adhesive dispensing weight control
Curing Temperature Range	80–200 °C	Temperature range for adhesive curing process
Substrate Size	50×50–300×300 mm	Maximum substrate handling capability
Adhesive Viscosity Range	1000–50000 mPa·s	Compatible with dispensing system
Operating Temperature	15–35 °C	For stable machine performance
Operating Humidity	30–70 %RH	Non-condensing
Power Supply	220–240 V AC	Single phase, 50/60 Hz
Air Supply Pressure	0.5–0.7 MPa	For pneumatic actuators
Machine Weight	1500–2500 kg	Depending on configuration
Footprint (L×W×H)	2000×1500×1800 mm	Approximate dimensions

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

Pick-and-Place Head
Precisely picks dies from source and places them onto substrates

Material: Stainless steel with ceramic tips
Vision Alignment System
Provides optical recognition and alignment of dies and substrates

Material: Aluminum housing with glass lenses
Dispensing Unit
Applies controlled amounts of adhesive to substrates

Material: Stainless steel with PTFE components
Wafer Frame Handler
Automatically loads and positions wafer frames for die pickup

Material: Anodized aluminum
Curing Station
Provides heat or UV exposure to cure adhesives after placement

Material: Stainless steel with heating elements
Vacuum Collet
Picks the die off the wafer frame by suction.
Force Sensors Optional
Measure bonding force to keep placement accuracy and bond quality in closed loop.

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Die Attach Machine.

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Frequently Asked Questions

What is the placement accuracy of the die attach machine?

The placement accuracy is ±0.05 μm, as listed in the reference specifications. This value indicates the maximum deviation from the target placement position. Actual performance may vary depending on the specific model and setup; always confirm with the manufacturer.

What die sizes can this machine handle?

The machine can handle die sizes ranging from 0.2×0.2 mm to 50×50 mm. This range covers a wide variety of semiconductor dies. For specific die size requirements, verify compatibility with the supplier.

What is the throughput rate?

The throughput rate is 3000–8000 units per hour (UPH), depending on the configuration and process parameters. This is a reference range; actual throughput may vary based on die size, adhesive type, and curing time.

What are the operating environment requirements?

The machine operates in a temperature range of 15–35 °C and humidity of 30–70% RH (non-condensing). It requires a power supply of 220–240 V AC, single phase, 50/60 Hz, and an air supply pressure of 0.5–0.7 MPa. Ensure these conditions are met for stable performance.

Data Basis

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pressure:	0.5-5.0 kgf (bonding force range)
other spec:	Placement accuracy: ±5-15 μm, Throughput: 5-20k UPH, Adhesive dispense volume: 0.1-10 mg
temperature:	20-30°C (operating environment), 150-200°C (curing temperature range)

Product Specifications

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