Editorial Technical Reference

DICOM Interface Module

This page explains how DICOM Interface Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A hardware/software component enabling DICOM-based communication between a Treatment Planning Station and medical imaging devices.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for DICOM Interface Module

Definition
The DICOM Interface Module is a component of a Treatment Planning Station that enables the import, export, and processing of medical imaging data in compliance with the Digital Imaging and Communications in Medicine (DICOM) standard. It acts as a communication bridge between treatment planning software and imaging equipment such as CT scanners, MRI machines, and PET scanners, ensuring data transfer, format conversion, and protocol handling for radiation therapy planning. The module implements DICOM protocols to establish network connections, receive image sets and metadata, validate and convert data, and make it available to the planning software. It typically includes DICOM Service Class Provider (SCP) and Service Class User (SCU) functionalities for storage, query/retrieve, and verification services. The module is housed in a plastic enclosure with a printed circuit board and electronic components. It operates on a wide input voltage range of 9–36 V DC, consumes 5–15 W, and functions in ambient temperatures of 0–40 °C. Storage temperature ranges from -20 to 60 °C, and relative humidity is 10–90% non-condensing. Ingress protection is rated IP20–IP42 per IEC 60529, depending on enclosure. Communication is via Ethernet with auto-negotiation at 10/100/1000 Mbps per IEEE 802.3. DICOM conformance is version 3.0 per DICOM PS3. Sustained data transfer rate is 10–100 MB/s. Dimensions are 150×40×120 mm (W×H×D), and weight is 0.5–1.0 kg depending on configuration. Mean time between failures (MTBF) is calculated at 50,000 hours per Telcordia SR-332. These values are reference ranges; verify model-specific specifications with the legal manufacturer. The module is intended for integration into Treatment Planning Stations and is not a standalone device. It requires a compatible host system and network infrastructure. For procurement, confirm DICOM conformance, electrical ratings, and environmental limits with the supplier.
Working Principle
The module operates by implementing DICOM protocols to establish network connections with imaging devices. It acts as a DICOM SCP to receive image sets and metadata, and as an SCU to query/retrieve from other devices. It validates incoming data, performs format conversion if needed, and transfers the data to the treatment planning software via an internal interface. The module handles storage, query/retrieve, and verification services, ensuring reliable data exchange. It uses Ethernet for network communication and manages data flow at rates up to 100 MB/s. The module's firmware manages protocol handling and data integrity. It is powered by a DC supply and operates within specified environmental limits. The module does not perform image analysis; it only facilitates data transfer and protocol compliance.
Common Materials
Printed Circuit Board, Electronic Components, Plastic Housing
Technical Parameters
ParameterTypical rangeNotes & selection driver
Operating Voltage9–36 V DCWide input range for medical environments
Power Consumption5–15 WTypical depending on configuration
Operating Temperature0–40 °CMedical device ambient range
Storage Temperature-20–60 °CNon-operational storage
Relative Humidity10–90 %Non-condensing
Ingress ProtectionIP20–IP42Depends on enclosureIEC 60529
Communication Interface10/100/1000 MbpsEthernet, auto-negotiationIEEE 802.3
DICOM Conformance3.0Latest standardDICOM PS3
Data Transfer Rate10–100 MB/sSustained throughput
Dimensions (W×H×D)150×40×120 mmCompact module
Weight0.5–1.0 kgDepending on configuration
MTBF50000 hCalculated per Telcordia SR-332

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Network Interface Card
    Provides physical network connectivity for DICOM communication
    Material: Fiberglass PCB with copper traces
  • DICOM Protocol Processor
    Handles DICOM message parsing, validation, and protocol operations
    Material: Silicon chip with embedded firmware
  • Data Buffer Memory Part
    Temporarily stores incoming and outgoing DICOM data during transfer
    Material: DRAM modules

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: N/A (data communication interface)
other spec: Network bandwidth: 1 Gbps minimum, DICOM conformance: PS3.1-2023b, Data throughput: 100+ studies/hour
temperature: 10°C to 40°C (operating), -20°C to 70°C (storage)
Media Compatibility
✓ CT/MRI/PET imaging devices ✓ Radiotherapy treatment planning systems ✓ PACS/imaging archives
Unsuitable: High EMI/RFI environments without proper shielding
Sizing Data Required
  • Number of concurrent DICOM associations required
  • Average study size and transfer frequency
  • Required DICOM service classes (STORAGE, QUERY/RETRIEVE, PRINT, etc.)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Data Corruption
Cause: Software bugs, network packet loss, or hardware memory faults leading to incomplete or erroneous DICOM data transmission and storage.
Interface Communication Failure
Cause: Physical connector wear, electromagnetic interference (EMI), or protocol mismatch disrupting the connection between the DICOM module and medical imaging devices or PACS systems.
Maintenance Indicators
  • Frequent error logs or alerts indicating DICOM transmission failures or data integrity issues.
  • Intermittent connectivity or slow data transfer rates between the module and connected devices.
Engineering Tips
  • Implement regular software updates and patches to address known vulnerabilities and ensure compatibility with evolving DICOM standards and connected systems.
  • Establish a preventive maintenance schedule that includes cleaning connectors, verifying cable integrity, and testing EMI shielding to maintain reliable physical and electrical connections.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
ISO 12052:2017 (DICOM Standard) ANSI/ISO 12052:2017 (DICOM Standard) CE Marking (Medical Device Directive 93/42/EEC)

Quoted from the published standard.

Manufacturing Precision
  • Data Transfer Rate: +/- 5% of specified bandwidth
  • Image Data Integrity: 0% error tolerance in transmission
Quality Inspection
  • Interoperability Conformance Testing (IHE Connectathon)
  • Data Integrity Verification (Checksum/CRC validation)

Manufacturers of DICOM Interface Module

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Frequently Asked Questions

What is the DICOM Interface Module used for?

It enables a Treatment Planning Station to communicate with medical imaging devices using the DICOM standard, facilitating import, export, and processing of imaging data for radiation therapy planning.

What are the key electrical specifications?

Operating voltage is 9–36 V DC, power consumption is 5–15 W, and operating temperature is 0–40 °C. These are reference ranges; confirm with the manufacturer for your model.

Does the module support DICOM conformance?

It is designed for DICOM conformance version 3.0 per DICOM PS3. However, conformance must be verified with the legal manufacturer for the specific configuration.

What communication interfaces does it have?

It has Ethernet with auto-negotiation at 10/100/1000 Mbps per IEEE 802.3. Ensure your network infrastructure is compatible.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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