Editorial Technical Reference

Flat Panel Detector

This page explains how Flat Panel Detector is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.

Technical Definition & Core Assembly

A digital X-ray imaging component that converts X-ray radiation into electronic signals for medical imaging.

Representative product image. Confirm appearance and specifications with the manufacturer.

Product Specifications

Technical details and manufacturing context for Flat Panel Detector

Definition
This flat panel detector is a digital X-ray imaging component used in radiation therapy simulators. It captures high-resolution X-ray images for patient positioning, treatment planning verification, and quality assurance in radiation oncology. The detector replaces traditional film-based systems with digital technology, enabling immediate image acquisition and analysis. It features an active imaging area of 17×17 inches, with pixel pitch ranging from 139 to 200 micrometers, providing spatial resolution between 3.1 and 4.0 line pairs per millimeter. The detector supports frame rates of 15 to 30 frames per second for dynamic imaging and operates within an energy range of 40 to 150 kVp. Analog-to-digital conversion is 14 to 16 bits, enhancing contrast resolution. The device operates in temperatures from 5 to 35°C and can be stored in -10 to 50°C. Operating humidity is 30 to 75% RH (non-condensing). It has an ingress protection rating of IP54 to IP65 per IEC 60529, indicating dust and water resistance. The weight ranges from 3 to 10 kg, and power consumption is 15 to 40 W. Materials include amorphous silicon (a-Si), cesium iodide (CsI) scintillator, and gadolinium oxysulfide (Gd₂O₂S). These specifications are typical ranges; actual values must be verified with the manufacturer for the specific model. The detector is a critical component in radiation therapy simulators, ensuring accurate imaging for treatment planning and delivery.
Working Principle
The detector uses an array of photodiodes and thin-film transistors (TFTs) on a flat panel substrate. When X-rays strike the scintillator layer, they are converted to visible light. This light is then detected by the photodiodes, which convert it into electrical signals. These signals are digitized to create medical images. The scintillator materials, such as cesium iodide or gadolinium oxysulfide, efficiently absorb X-rays and emit light proportional to the incident radiation. The TFT array reads out the charge from each photodiode, enabling high-resolution imaging. The digital output allows immediate image display and analysis, facilitating real-time guidance during radiation therapy procedures.
Common Materials
Amorphous Silicon (a-Si), Cesium Iodide (CsI) scintillator, Gadolinium Oxysulfide (Gd₂O₂S)
Technical Parameters
ParameterTypical rangeNotes & selection driver
Detector Size17×17 inchActive imaging area
Pixel Pitch139–200 μmSmaller pitch gives higher resolution
Spatial Resolution3.1–4.0 lp/mmDetermines image sharpness
Frame Rate15–30 fpsFor dynamic imaging
Energy Range40–150 kVpX-ray tube voltage
AD Conversion14–16 bitHigher bit depth improves contrast
Operating Temperature5–35 °COutside range may affect performance
Storage Temperature-10–50 °CFor non-operating conditions
Operating Humidity30–75 %RHNon-condensing
Ingress ProtectionIP54–IP65Dust and water resistanceIEC 60529
Weight3–10 kgDepends on size and materials
Power Consumption15–40 WTypical operating power

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM
  • Scintillator Layer Part
    Converts X-ray photons to visible light photons
    Material: Cesium Iodide (CsI) or Gadolinium Oxysulfide (Gd₂O₂S)
  • Photodiode Array
    Detects visible light and converts it to electrical charge
    Material: Amorphous Silicon (a-Si)
  • Thin-Film Transistor (TFT) Array Part
    Reads and transfers electrical signals from photodiodes
    Material: Amorphous Silicon (a-Si)
  • Readout Electronics
    Amplifies, digitizes, and processes electrical signals
    Material: Silicon-based integrated circuits

Applied To / Applications

This component is essential for the following industrial systems and equipment:

Industrial Ecosystem & Supply Chain Structure

Complementary Systems
Downstream Applications
Specialized Tooling

Application Fit & Sizing Matrix

Operational Limits
pressure: Atmospheric pressure only (non-pressurized device)
other spec: Humidity: 30-75% RH (non-condensing), Radiation exposure limits per IEC 60601-1-3
temperature: 10°C to 40°C (operating), -20°C to 60°C (storage)
Media Compatibility
✓ Medical X-ray imaging ✓ Non-destructive testing of electronics ✓ Security screening applications
Unsuitable: High-vibration industrial environments (e.g., heavy machinery monitoring)
Sizing Data Required
  • Required image resolution (pixel pitch in microns)
  • Detector active area dimensions (cm x cm)
  • Frame rate requirements (frames per second)

Reliability & Engineering Risk Analysis

Failure Mode & Root Cause
Pixel Degradation
Cause: Thermal stress from repeated heating/cooling cycles during operation and calibration, combined with material fatigue in thin-film transistors (TFTs) and photodiodes, leading to dead pixels, reduced sensitivity, or image artifacts.
Delamination or Moisture Ingress
Cause: Failure of edge seals or protective layers due to mechanical stress, environmental humidity, or chemical exposure, compromising the hermetic enclosure and allowing moisture or contaminants to damage internal electronics and scintillator layers.
Maintenance Indicators
  • Persistent image artifacts (e.g., lines, spots, or non-uniform areas) that remain after recalibration, indicating pixel or sensor damage.
  • Audible buzzing or clicking from the detector housing, suggesting loose internal components, failing cooling fans, or electrical arcing.
Engineering Tips
  • Implement controlled thermal management: Ensure stable ambient temperatures and allow proper cool-down periods between scans to minimize thermal cycling stress on sensitive components.
  • Regularly inspect and maintain sealing integrity: Check edge seals and enclosures for cracks or wear, and use environmental monitors to detect early signs of humidity ingress before internal damage occurs.

Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.

Compliance & Manufacturing Standards

Applicable Standards
IEC 60601-1:2005+AMD1:2012+AMD2:2020 - Medical electrical equipment - Part 1: General requirements for basic safety and essential performance CE Marking - Directive 93/42/EEC (Medical Devices Directive) or Regulation (EU) 2017/745 (MDR)

Quoted from the published standard.

Manufacturing Precision
  • Pixel Pitch Uniformity: +/- 0.5% across active area
  • Detector Flatness: 0.2 mm maximum deviation over entire surface
Quality Inspection
  • Image Quality Performance Test (MTF, DQE, uniformity)
  • Environmental and Durability Testing (shock, vibration, temperature/humidity cycling)

Manufacturers of Flat Panel Detector

Manufacturer profiles associated with Flat Panel Detector.

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Frequently Asked Questions

What is the active imaging area of this flat panel detector?

The active imaging area is 17×17 inches, as listed in the specifications. However, you should confirm the exact dimensions with the manufacturer for the specific model you are considering.

What is the pixel pitch range?

The pixel pitch ranges from 139 to 200 micrometers. A smaller pitch generally provides higher resolution, but the actual value depends on the model. Verify with the manufacturer.

What is the operating temperature range?

The operating temperature range is 5 to 35°C. For storage, the range is -10 to 50°C. Ensure the detector is used within these limits to maintain performance.

What ingress protection rating does it have?

The ingress protection rating is IP54 to IP65 per IEC 60529, indicating dust and water resistance. The specific rating for your model should be confirmed with the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification
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