High-Speed Capture Module for Network Analyzers

Product Specifications

Technical details and manufacturing context for High-Speed Capture Module

Definition

The High-Speed Capture Module is a critical hardware component within a Multi-Protocol Network Protocol Analyzer. Its primary role is to intercept, timestamp, and buffer raw network data packets from one or more physical interfaces at line rates, enabling deep packet inspection, performance monitoring, and troubleshooting across various network protocols without dropping packets. The module is designed for integration into analyzer systems, typically as a PCIe add-in card. It connects directly to network taps or SPAN/mirror ports, using dedicated high-speed PHY chips and FPGA/ASIC logic to receive electrical or optical signals, perform clock recovery, decode the physical layer, and frame data into packets. These packets are timestamped with nanosecond precision, buffered in high-speed memory (DDR SDRAM), and transferred via a high-bandwidth bus (e.g., PCIe 3.0 x8) to the analyzer's main processing unit for protocol decoding and analysis. The module supports sustained capture rates of 10–100 Gbps without packet loss, with timestamp resolution of 1–10 ns (IEEE 1588). Onboard memory ranges from 4–16 GB to buffer bursts and aid in timestamping. The module operates in a temperature range of 0–70 °C, with non-condensing humidity of 5–95% RH. Power consumption is 15–25 W, and the form factor is low-profile HHHL (PCIe CEM). MTBF is rated at 50,000–100,000 hours (Telcordia SR-332). Weight varies with heatsink and bracket, typically 200–400 g. Materials include PCB, FPGA/ASIC, high-speed memory, network PHY transceiver chips, and clock oscillators. For procurement, verify model-specific values and standards with the legal manufacturer or supplier.

Working Principle

The module operates by connecting directly to network taps or SPAN/mirror ports. It uses dedicated high-speed PHY chips and FPGA/ASIC logic to receive electrical/optical signals, perform clock recovery, decode the physical layer, and frame the data into packets. These packets are timestamped with nanosecond precision, buffered in high-speed memory (DDR), and then transferred via a high-bandwidth bus (e.g., PCIe) to the analyzer's main processing unit for protocol decoding and analysis.

Common Materials

Printed Circuit Board (PCB), FPGA or ASIC, High-Speed Memory (DDR SDRAM), Network PHY Transceiver Chips, Clock Oscillators

Technical Parameters

Parameter	Typical range	Notes & selection driver
Capture Rate	10–100 Gbps	Sustained line-rate capture without packet loss
Timestamp Resolution	1–10 ns	Higher resolution for precise latency analysisIEEE 1588
PCIe Interface	3.0 x8	Ensures sufficient host bandwidthPCIe 3.0
Onboard Memory	4–16 GB	Buffers bursts and aids in timestamping
Operating Temperature	0–70 °C	Extended range available for industrial
Power Consumption	15–25 W	Depends on capture rate and memory
Form Factor	HHHL	Low-profile for 1U serversPCIe CEM
Operating Humidity	5–95 % RH	Non-condensing
MTBF	50000–100000 h	High reliability for 24/7 operationTelcordia SR-332
Weight	200–400 g	Varies with heatsink and bracket

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Components / BOM

PHY Transceiver
Converts the physical electrical/optical signal from the network cable into a digital data stream.

Material: Semiconductor (Silicon)
FPGA/ASIC Processing Core
The main logic unit that handles packet framing, filtering, timestamping, and DMA control for transferring data to host memory.

Material: Semiconductor (Silicon)
High-Speed Clock Part
Provides a precise timing reference for accurate packet timestamping.

Material: Quartz Crystal
DDR Memory Bank
Provides volatile storage for buffering captured packets before they are transferred off the module.

Material: Semiconductor (Silicon), PCB
PCIe Bus
The host interface the buffered packets are DMAed out over.

Manufacturers of High-Speed Capture Module

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Frequently Asked Questions

What is the maximum capture rate of the High-Speed Capture Module?

The module supports sustained capture rates of 10–100 Gbps without packet loss, depending on the specific model and configuration. Verify the exact rate with the manufacturer.

What timestamp resolution does the module provide?

The module provides timestamp resolution of 1–10 nanoseconds, with support for IEEE 1588 precision time protocol. This enables precise latency analysis.

What is the typical power consumption?

Power consumption ranges from 15–25 W, depending on capture rate and memory configuration. Confirm the exact value for your application.

What is the operating temperature range?

The module operates in a temperature range of 0–70 °C, with non-condensing humidity of 5–95% RH. For industrial extended ranges, consult the manufacturer.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records.

Preliminary Technical Classification

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pressure:	N/A (electronic component)
other spec:	Network speed: 1 Gbps to 100 Gbps, Power: 12V DC ±10%, Humidity: 10% to 90% non-condensing
temperature:	0°C to 50°C (operating), -10°C to 70°C (storage)

High-Speed Capture Module

Product Specifications

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Application Fit & Sizing Matrix

Reliability & Engineering Risk Analysis

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