Photodetector array
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This page explains how Interconnection matrix is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A structured network of electrical connections that routes signals between individual photodetectors in an array.
Technical details and manufacturing context for Interconnection matrix
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Number of Inputs/Outputs | 8–64 channels | Determines array size and routing capacity |
| Operating Temperature | -40–85 °C | Beyond this range, signal integrity degrades |
| Insertion Loss | ≤0.5 dB | Lower is better for signal fidelity |
| Crosstalk Isolation | ≥60 dB | Prevents signal interference between channels |
| Bandwidth | DC–10 GHz | Supports high-speed photodetector signals |
| Contact Resistance | ≤50 mΩ | Low resistance ensures minimal signal loss |
| Insulation Resistance | ≥1000 MΩ | At 500 V DC; ensures electrical safety |
| Dielectric Withstanding Voltage | 500 V DC | Withstands 500 V for 1 minute without breakdown |
| Operating Humidity | 5–95 % RH | Non-condensing; high humidity may cause corrosion |
| Ingress Protection | IP54–IP65 | Protects against dust and water jetsIEC 60529 |
| Connector Type | SMA–2.92 | Compatible with standard RF connectors |
| Dimensions | 100×80×20 mm | Compact footprint for integration |
| Weight | ≤200 g | Lightweight for portable equipment |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric to 1.5 bar |
| other spec: | Signal frequency range: DC to 10 GHz, Crosstalk: < -40 dB |
| temperature: | -40°C to +85°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Interconnection matrix.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The interconnection matrix provides the electrical pathways that connect individual photodetectors to readout circuitry, enabling signal transmission and spatial resolution across the array.
Key specifications include insertion loss (≤0.5 dB), crosstalk isolation (≥60 dB), bandwidth (DC–10 GHz), contact resistance (≤50 mΩ), and insulation resistance (≥1000 MΩ at 500 V DC). Always confirm these values for your specific model.
It operates from -40 to 85 °C, 5–95% RH non-condensing, and has ingress protection IP54–IP65 per IEC 60529. High humidity may cause corrosion, so verify suitability for your environment.
The ingress protection rating references IEC 60529, but this is a procurement reference. Confirm with the manufacturer that the specific model meets your required standards and performance parameters.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
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