Wave Soldering Machine
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This page explains how Nitrogen Atmosphere System is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A system that creates and maintains a nitrogen-rich environment in the wave soldering process to prevent oxidation and improve solder joint quality.
Technical details and manufacturing context for Nitrogen Atmosphere System
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Nitrogen Purity | 99.99–99.999 % | Higher purity reduces oxidation but increases cost.ISO 14644-1 |
| Flow Rate | 5–20 m³/h | Adjust based on oven size and conveyor speed. |
| Oxygen Concentration | ≤100 ppm | Lower oxygen levels prevent solder oxidation. |
| Operating Pressure | 0.4–0.6 MPa | Below 0.4 MPa may cause insufficient nitrogen supply. |
| Temperature Range | 20–50 °C | Ambient operating temperature for the system. |
| Relative Humidity | ≤85 % RH | High humidity may affect nitrogen purity. |
| Power Supply | 220–380 V AC | Voltage depends on regional standard.IEC 60038 |
| Power Consumption | 0.5–2.5 kW | Includes control system and valves. |
| Control Accuracy | ±1 % FS | Accuracy of oxygen analyzer and flow control. |
| Response Time | ≤5 s | Time to reach set oxygen level after disturbance. |
| Ingress Protection | IP54–IP65 | Protects against dust and water jets.IEC 60529 |
| Weight | 150–350 kg | Depends on configuration and accessories. |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Nitrogen Atmosphere System.
This component is essential for the following industrial systems and equipment:
| pressure: | 0.5 to 2.0 bar (operating pressure range) |
| dew point: | -40°C to -60°C (moisture control specification) |
| flow rate: | 10 to 100 L/min (adjustable based on chamber volume) |
| temperature: | Ambient to 300°C (typical wave soldering process temperature) |
| nitrogen purity: | 99.99% to 99.999% (oxygen content <100 ppm) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Nitrogen Atmosphere System.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
It displaces oxygen in the soldering zone with nitrogen gas to prevent oxidation of solder and component leads, improving solder joint quality and reducing defects.
Typical purity ranges from 99.99% to 99.999%, depending on the application. Higher purity reduces oxidation but increases cost.
The system uses controlled gas flow and pressure to maintain a positive pressure environment. Sensors monitor oxygen levels, often keeping them below 1000 ppm, with a response time of ≤5 seconds.
Relevant standards include ISO 14644-1 for nitrogen purity, IEC 60038 for power supply, and IEC 60529 for ingress protection. Always confirm compliance with the manufacturer.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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