This page explains how Wave Soldering Machine is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
An automated soldering system that creates permanent electrical connections on printed circuit boards by passing them over a molten solder wave.
Technical details and manufacturing context for Wave Soldering Machine
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Conveyor SpeedRequired | 0.5–2.0 m/min | Speed at which PCBs travel through the soldering process |
| Solder TemperatureRequired | 250–270 °C | Temperature of the molten solder in the wave pot |
| Wave HeightRequired | 5–12 mm | Height of the solder wave above the nozzle |
| PCB Width CapacityRequired | 50–450 mm | Maximum width of PCB that can be processed |
| Preheat TemperatureRequired | 80–150 °C | Temperature in the preheating zone |
| Heating Power | 15–30 kW | Total power for preheat and solder pot |
| Conveyor Width Adjustment | Motorized | Automatic width adjustment for different PCB sizes |
| Solder Capacity | 300–600 kg | Amount of solder in the pot |
| Control System | PLC + HMI | Programmable logic controller with touchscreen interface |
| Power Supply | 380 ±10% V AC | Three-phase, 50/60 Hz |
| Air Pressure | 0.5–0.7 MPa | For pneumatic components |
| Overall Dimensions | 4000–8000 × 1200–1500 × 1500–1800 mm | Length × width × height |
| Weight | 1500–3000 kg | Depends on configuration |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Wave Soldering Machine.
| pressure: | 0.1-0.5 bar (wave pressure) |
| flow rate: | 10-50 L/min (solder circulation) |
| temperature: | 240-280°C (solder pot temperature) |
| conveyor speed: | 0.5-3.0 m/min |
| preheat temperature: | 80-150°C |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Wave soldering machines are designed for through-hole components. The PCB width capacity is typically 50–450 mm, but the actual range depends on the specific model. Verify the maximum board width and component height clearance with the manufacturer.
Common parameters include conveyor speed of 0.5–2.0 m/min, solder temperature of 250–270°C, wave height of 5–12 mm, and preheat temperature of 80–150°C. These values are reference ranges; the optimal settings depend on the solder alloy, PCB design, and component types.
Regular maintenance includes checking solder level and composition, cleaning the flux nozzle and conveyor rails, inspecting the pump and heating elements, and calibrating temperature sensors. The frequency depends on usage and manufacturer recommendations. Always follow the supplier's maintenance schedule.
Operators should be trained on handling molten solder, which can cause severe burns. The machine must have proper ventilation to remove fumes. Electrical safety is critical due to high power consumption (15–30 kW). Ensure emergency stops and guards are functional. Refer to the manufacturer's safety manual.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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