This page explains how Semiconductor Device is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
A semiconductor device is an electronic component that utilizes the electrical properties of semiconductor materials (primarily silicon, germanium, and gallium arsenide) to control the flow of electrical current.
Technical details and manufacturing context for Semiconductor Device
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Maximum Forward Current | 1–100 A | Exceeding this may cause thermal runawayIEC 60747 |
| Reverse Breakdown Voltage | 50–1200 V | Higher values for power devicesIEC 60747 |
| Switching Frequency | 1–100 kHz | Depends on device type and application |
| Operating Temperature Range | -40–85 °C | Junction temperature may be higherIEC 60747 |
| Power Dissipation | 0.5–500 W | Requires adequate heat sinking |
| Package Type | SOT-23–TO-247 | Affects thermal and mountingJEDEC |
| Mounting Type | SMD/THT | SMD for automated assembly |
| ESD Rating | 1–8 kV | HBM modelIEC 61340 |
| Humidity Sensitivity Level | 1–5 | Lower is better for moisture resistanceIPC/JEDEC J-STD-020 |
| Lead-Free | Yes | Required for EU marketRoHS |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Semiconductor Device.
This component is essential for the following industrial systems and equipment:
| current: | From microamps to hundreds of amps depending on device |
| voltage: | Varies by device type (e.g., 1.2V to 1000V+) |
| frequency: | DC to GHz range depending on semiconductor technology |
| temperature: | -40°C to +125°C (operating), -65°C to +150°C (storage) |
| power dissipation: | Milliwatts to kilowatts based on package and cooling |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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According to the directory, the maximum forward current ranges from 1 to 100 A, as referenced in IEC 60747. However, this is a general range; you must verify the specific value for the intended model and application with the manufacturer.
The directory lists IEC 60747 for electrical parameters, JEDEC for package types, IEC 61340 for ESD rating, IPC/JEDEC J-STD-020 for humidity sensitivity, and RoHS for lead-free compliance. These standards serve as references for verification, not as proof of certification.
The directory lists silicon, gallium arsenide, and silicon carbide as materials on file. The choice of material affects performance characteristics, but specific properties must be confirmed with the supplier.
You should compare the device's parameters (such as forward current, breakdown voltage, switching frequency, and thermal limits) against your application requirements. Always consult the manufacturer's datasheet and confirm compliance with relevant standards.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
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