Heating/Cooling Element
View system integration details
This page explains how Thermoelectric Module is classified within Computer, Electronic and Optical Product Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
Solid-state device that converts electrical energy into a temperature difference (Peltier effect) or generates electricity from a temperature gradient (Seebeck effect).
Technical details and manufacturing context for Thermoelectric Module
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Maximum Temperature Difference | 60–70 K | At zero heat load; decreases with applied load |
| Heat Pumping Capacity | 10–100 W | At ΔT=0 and rated current |
| Maximum Operating Current | 3–10 A | Exceeding may cause thermal runaway |
| Maximum Operating Voltage | 12–24 V DC | At maximum temperature difference |
| AC Resistance | 1–10 Ω | At 25°C, measured at 1 kHz |
| Maximum Operating Temperature | 150–200 °C | Hot side temperature; solder melting limit |
| Storage Temperature | -40–85 °C | Non-operating, in original packaging |
| Humidity | 5–95 % RH | Non-condensing; condensation may cause corrosion |
| Sealing | IP54–IP65 | Higher IP for dusty or wet environmentsIEC 60529 |
| Ceramic Substrate | Al2O3 96% | Alumina; AlN for higher thermal conductivity |
| Solder Temperature | 250–300 °C | For assembly; avoid exceeding 300°C |
| Weight | 10–100 g | Depends on size and heat sink |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is essential for the following industrial systems and equipment:
| pressure: | Atmospheric to low-pressure environments (typically < 2 atm); not designed for high-pressure systems |
| other spec: | Max current: 1-15A typical, Max voltage: 2-24V typical, Thermal resistance: 0.1-5 K/W, Heat pumping capacity: 1-500W typical |
| temperature: | Typically -100°C to +200°C (hot side temperature), with specific modules rated for cryogenic or high-temperature applications |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
2 companies list this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The maximum temperature difference is typically 60–70 K at zero heat load. This value decreases when a heat load is applied. Always verify the specific rating for your model.
Yes. By reversing the polarity of the DC current, the hot and cold sides swap, allowing the module to either cool or heat. This makes it versatile for temperature stabilization.
The module typically uses bismuth telluride (Bi2Te3) semiconductors, ceramic substrates (alumina or aluminum nitride), copper interconnects, and solder. These materials are standard for Peltier devices.
The maximum operating temperature is typically 150–200°C on the hot side, limited by the solder melting point. Exceeding this can cause failure. Always check the datasheet for your specific module.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
Ask for use case, specification boundaries, supplier type, and RFQ preparation information for this product.
Compare manufacturer profiles with relevant product and process capability.