A precision resistor used to measure current flow in electrical circuits by converting current to a measurable voltage drop.
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Tolerance | ±0.1% to ±5% | |
| Inductance | <10 nH | |
| Power Rating | 0.25W to 5W | |
| Package Types | SMD (1206, 2010, 2512), Through-hole, Four-terminal Kelvin configuration | |
| Resistance Range | 0.001Ω to 1Ω | |
| Operating Temperature | -55°C to +155°C | |
| Temperature Coefficient (TCR) | ±15 ppm/°C to ±100 ppm/°C |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
This component is used in the following industrial products
The High-Efficiency LED Driver Module is a compact electronic component that converts alternating current (AC) mains power into the regulated direct current (DC) required by LED lighting arrays.
A circuit or mechanism within a power supply module that safeguards connected devices by monitoring and controlling the output voltage and current.
An electronic circuit designed to safeguard electrical systems and components from damage due to overvoltage, overcurrent, short circuits, or other fault conditions.
A practical evidence checklist for RFQ preparation and supplier evaluation.
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Manufacturer profiles associated with Current Sense Resistor.
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Four-terminal configurations separate current-carrying and voltage-sensing paths, eliminating measurement errors caused by contact resistance and lead resistance, ensuring highly accurate current measurement.
Temperature changes cause resistance variations due to the resistor's Temperature Coefficient of Resistance (TCR). High-quality current sense resistors use low-TCR materials (like MnCu alloys) and proper thermal management to minimize these effects in LED driver applications.
Key factors include: resistance value and tolerance for required accuracy, power rating to handle maximum current, low TCR for temperature stability, low inductance to prevent measurement errors at switching frequencies, and package type for PCB layout and thermal performance.
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