Diode Chip: Voltage Rating 600V to 1700V

Component Specifications

Definition

A diode chip is a semiconductor device fabricated on a silicon wafer that allows current to flow primarily in one direction. In IGBT modules, it serves as a freewheeling diode to provide a path for inductive load current during switching transitions, preventing voltage spikes and protecting the IGBT from reverse recovery stress. It features a PN junction with optimized doping profiles for high voltage blocking capability, low forward voltage drop, and fast switching characteristics essential for efficient power conversion.

Working Principle

Operates based on the PN junction principle: under forward bias, it conducts current with low resistance; under reverse bias, it blocks current until the breakdown voltage is exceeded. In IGBT modules, it commutates with the IGBT during switching to manage inductive energy, ensuring smooth current flow and minimizing switching losses.

Materials

Silicon (Si) or Silicon Carbide (SiC) semiconductor material with epitaxial layers; aluminum or copper metallization for contacts; passivation layers (e.g., silicon nitride, polyimide).

Technical Parameters

Parameter	Typical range	Notes & selection driver
Package Type	Chip-on-substrate (direct bond)
Current Rating	10A to 600A
Voltage Rating	600V to 1700V
Forward Voltage Drop	1.2V to 2.5V at rated current
Junction Temperature	-40°C to 175°C
Reverse Recovery Time	35ns to 200ns

Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.

Standards

IEC 60747, JEDEC JESD22, ISO 16750

Parent Products

This component is used in the following industrial products

IGBT Module

A power semiconductor device used for high-power switching in plasma power supplies

View Product Details

Engineering Analysis

Risks & Mitigation

Thermal overstress leading to junction failure
Reverse recovery voltage spikes causing breakdown
Contamination during manufacturing affecting reliability

FMEA Triads

Trigger: Excessive junction temperature from inadequate cooling
Failure: Thermal runaway and permanent short circuit
Mitigation: Implement thermal management with heatsinks, monitor temperature sensors, and use derating guidelines.

Trigger: High dv/dt during switching
Failure: Reverse recovery failure and avalanche breakdown
Mitigation: Use snubber circuits, optimize gate drive timing, and select diodes with soft recovery characteristics.

Trigger: Mechanical stress from thermal cycling
Failure: Crack formation in silicon or bond wire lift-off
Mitigation: Apply conformal coatings, use robust packaging designs, and conduct accelerated life testing.

Industrial Ecosystem

Compatible With

IGBT modules for motor drives, inverters, UPS systems

Typical Suppliers & Equivalents

Infineon, Mitsubishi Electric, Fuji Electric, STMicroelectronics, ON Semiconductor

Compliance & Inspection

Tolerance

±5% on forward voltage, ±10% on reverse recovery time under specified conditions

Test Method

Dynamic and static electrical testing per IEC 60747-2, thermal cycling per JESD22-A104

Procurement Evaluation Criteria

A practical evidence checklist for RFQ preparation and supplier evaluation.

Technical documentation

Request current drawings, revision history, and a signed specification sheet.

Manufacturing capability

Verify equipment lists, process limits, capacity, and representative production evidence.

Inspection readiness

Confirm test methods, calibrated equipment, sampling plans, and traceable reports.

Supplier transparency

Check the legal entity, factory address, ownership, certifications, and direct contacts.

CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.

Manufacturers of Diode Chip

1 company lists this product among what they make. Company figures are quoted from each company's own website; every card states where the relationship came from.

GLSUN (Guilin GLSUN Science and Tech Group Co.,Ltd)

Guangxi, CN

Also makes: Communication Network, Transceiver Module, Transmission

Listed on the company's own website · profile compiled by CNFX from public sources

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Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.

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Frequently Asked Questions

What is the role of a diode chip in an IGBT module?

It acts as a freewheeling diode to provide a path for inductive current when the IGBT switches off, preventing voltage spikes and protecting the circuit.

How does a diode chip differ from a standard diode?

Diode chips in IGBT modules are optimized for high-frequency switching, low forward voltage, and thermal stability, often using advanced materials like SiC for higher efficiency.

What are common failure modes of diode chips?

Thermal runaway due to overheating, reverse recovery failure, and bond wire fatigue from thermal cycling.

Data Basis

Editorial classification, named public sources where available, and source-reviewed manufacturer records. See the editorial policy.

Preliminary Technical Classification

This page supports structured research, RFQ preparation, and supplier evaluation. It does not replace buyer-led supplier qualification, standards review, or technical approval.

Diode Chip