INDUSTRY COMPONENT

Epoxy Base Resin

Epoxy base resin is a thermosetting polymer used as the primary binder in electrical-grade epoxy compounds for insulation and encapsulation.

Component Specifications

Definition
Epoxy base resin is a synthetic thermosetting polymer derived from epichlorohydrin and bisphenol-A, characterized by its excellent electrical insulation properties, high mechanical strength, chemical resistance, and thermal stability. In electrical-grade epoxy resin compounds, it serves as the matrix material that binds fillers, hardeners, and additives to form rigid, durable insulating components for electrical equipment.
Working Principle
Epoxy base resin functions through a curing process initiated by a hardener (typically amines or anhydrides), which triggers cross-linking polymerization. This transforms the liquid resin into a solid, three-dimensional network structure, providing electrical insulation by preventing current leakage, mechanical support, and protection against environmental factors like moisture and chemicals.
Materials
Bisphenol-A epoxy resin (e.g., DGEBA type), with optional modifications for enhanced properties such as flame retardancy (e.g., brominated epoxy) or flexibility (e.g., aliphatic epoxy).
Technical Parameters
  • Viscosity 500-2000 cP at 25°C
  • Volume Resistivity 1e13-1e15 ohm·cm
  • Dielectric Strength 15-20 kV/mm
  • Thermal Conductivity 0.2-0.5 W/m·K
  • Epoxy Equivalent Weight 180-190 g/eq
  • Glass Transition Temperature 100-150°C
Standards
ISO 16797, DIN EN 60455

Industry Taxonomies & Aliases

Commonly used trade names and technical identifiers for Epoxy Base Resin.

Parent Products

This component is used in the following industrial products

Engineering Analysis

Risks & Mitigation
  • Incomplete curing leading to reduced insulation
  • Thermal degradation at high temperatures
  • Moisture absorption affecting dielectric properties
FMEA Triads
Trigger: Incorrect hardener ratio or mixing
Failure: Poor curing, resulting in weak mechanical strength and electrical failures
Mitigation: Strict process control, automated mixing systems, and quality checks
Trigger: Exposure to high humidity during storage
Failure: Reduced dielectric performance due to moisture absorption
Mitigation: Store in sealed containers with desiccants, control warehouse humidity

Industrial Ecosystem

Compatible With

Interchangeable Parts

Compliance & Inspection

Tolerance
±5% on viscosity and epoxy equivalent weight
Test Method
ISO 16797 for electrical properties, ASTM D257 for resistivity, IEC 60243 for dielectric strength

Buyer Feedback

★★★★☆ 4.5 / 5.0 (25 reviews)

"The Epoxy Base Resin we sourced perfectly fits our Electrical Equipment Manufacturing production line requirements."

"Found 15+ suppliers for Epoxy Base Resin on CNFX, but this spec remains the most cost-effective."

"The technical documentation for this Epoxy Base Resin is very thorough, especially regarding technical reliability."

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Frequently Asked Questions

What is the difference between epoxy base resin and cured epoxy?

Epoxy base resin is the uncured liquid or semi-solid precursor, while cured epoxy is the hardened, cross-linked final product after reaction with a hardener, exhibiting full mechanical and electrical properties.

Why is epoxy resin preferred for electrical applications?

It offers excellent dielectric strength, low moisture absorption, high adhesion, and thermal stability, making it ideal for insulating and protecting electrical components.

Can I contact factories directly?

Yes, each factory profile provides direct contact information.

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