AC-DC Converter
View system integration details
This page explains how Enclosure / Heat Sink is classified within Electrical Equipment Manufacturing. Technical values and manufacturer relationships are research references; confirm the current specification and supplier evidence for each order.
This component integrates the protective enclosure and heat dissipation system for AC-DC converters used in electrical equipment manufacturing.
Technical details and manufacturing context for Enclosure / Heat Sink
| Parameter | Typical range | Notes & selection driver |
|---|---|---|
| Dimensions (L×W×H) | 100×50×25–300×150×100 mm | Custom sizes available |
| Thermal Resistance | 0.5–2.0 K/W | Lower is better for heat dissipation |
| Material Grade | 6063-T5 | Aluminum alloyGB/T 3190 |
| Surface Treatment | Anodizing 10–25 μm | Improves corrosion resistanceISO 7599 |
| IP Rating | IP54–IP65 | Dust-tight and water-resistantIEC 60529 |
| Operating Temperature | -40–85 °C | Extended range available |
| Withstand Voltage | 1500 V AC | Between primary and secondaryIEC 60950-1 |
| Insulation Resistance | ≥100 MΩ | At 500 V DC |
| Weight | 0.5–3.0 kg | Depends on size and material |
| Tolerance | ±0.1 mm | For critical mounting dimensionsISO 2768-m |
| Surface Roughness | Ra 0.8–1.6 μm | For sealing surfacesISO 1302 |
| RoHS Compliance | 100 % | Lead-free and hazardous substance freeIEC 62321 |
Ranges are indicative industry figures for RFQ preparation, not a supplier commitment. Confirm every value and standard with the legal manufacturer before ordering.
Commonly used trade names and technical identifiers for Enclosure / Heat Sink.
This component is essential for the following industrial systems and equipment:
| pressure: | 0 to 1 atm (sealed enclosure), N/A for heat sink (ambient pressure) |
| other spec: | Thermal resistance: 0.5-2.0°C/W (depending on airflow), IP65/IP67 ingress protection, 500-2000W heat dissipation capacity |
| temperature: | -40°C to +125°C (operating), -55°C to +150°C (storage) |
Indicative industry ranges for design and RFQ preparation. Confirm the exact figures and applicable standard with the manufacturer before specifying.
Quoted from the published standard.
Manufacturer profiles associated with Enclosure / Heat Sink.
Manufacturer listings support early research and capability understanding. They are not certification, ranking, or transaction guarantees.
A practical evidence checklist for RFQ preparation and supplier evaluation.
CNFX does not score or rank suppliers. Buyers must verify all claims and documents with the legal manufacturer before ordering.
The component is typically made from aluminum alloy (grade 6063-T5 per GB/T 3190) or copper. Thermal interface materials are used to improve heat transfer between the electronics and the heat sink.
The enclosure offers IP ratings from IP54 to IP65 per IEC 60529, providing protection against dust and water. The specific rating depends on the model and application.
The heat sink uses conductive materials and extended surface area to transfer heat away from the electronics. Heat is conducted through the material and dissipated into the air via convection, aided by thermal interface materials for efficient transfer.
The component has a withstand voltage of 1500 V AC between primary and secondary per IEC 60950-1, and insulation resistance of ≥100 MΩ at 500 V DC per IEC 60243-1. These are reference values; verify with the manufacturer for the specific model.
Editorial classification, named public sources where available, and source-reviewed manufacturer records.
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